The **SCI1008S-R24F** is a specific surface-mount electronic component, primarily categorized as a **Wire-Wound Chip Inductor**. These parts are commonly used in high-frequency applications due to their excellent quality factor (Q) and stability. --- ### 1. Part Number Breakdown Understanding the nomenclature helps identify the component's physical and electrical characteristics: | Code Segment | Meaning | Description | | :--- | :--- | :--- | | **SCI** | Series Type | Standard Chip Inductor (Wire-wound) | | **1008** | Case Size | 1008 Imperial (approx. 2.5 x 2.0 mm) | | **S** | Material/Process | Standard or High Current (varies by manufacturer) | | **R24** | Inductance Value | **0.24 µH** (240 nH) | | **F** | Tolerance | **± 1%** (High precision) | --- ### 2. Key Technical Specifications While exact specs can vary slightly between manufacturers (like Signal or Chilisin), the standard parameters for an R24F in a 1008 package are: * **Inductance:** 240 nH (0.24 µH). * **Tolerance:** ± 1% (denoted by the 'F' suffix). * **Quality Factor (Q min):** Typically 45–50 at 100 MHz. * **Self-Resonant Frequency (SRF):** Usually around 500 MHz – 700 MHz. * **DC Resistance (DCR):** Max ~0.45 to 0.70 Ohms. * **Rated Current:** Generally between 400mA and 600mA. --- ### 3. Construction and Features The "S" in the series usually refers to a **ceramic core** wire-wound construction. * **Ceramic Core:** Provides exceptional thermal stability and a high SRF, making it ideal for RF (Radio Frequency) applications. * **Wire-Wound Design:** Uses a copper wire coiled around the core, offering much lower DC resistance and higher current handling compared to multilayer inductors of the same size. * **Epoxy Coating:** Usually features a top-side epoxy capsulation to allow for vacuum pick-and-place assembly. --- ### 4. Common Applications Due to the high precision (1%) and the 1008 form factor, this part is typically found in: 1. **RF Transceivers:** Used in matching circuits and filters for wireless communication. 2. **Bluetooth/Wi-Fi Modules:** Essential for signal integrity in compact wireless devices. 3. **Oscillators:** The high Q factor and tight tolerance (±1%) are critical for frequency stability. 4. **Impedance Matching:** Used to bridge the gap between antennas and power amplifiers. --- ### 5. Footprint (1008 Metric 2520) The physical dimensions are standardized for PCB layout: ```text Length: 2.50 mm (± 0.2mm) Width: 2.00 mm (± 0.2mm) Height: 1.60 mm (± 0.2mm) ``` ---