công cụ tìm kiếm bảng dữ liệu linh kiện điện tử
  Vietnamese  ▼
ALLDATASHEET.VN

X  

  • MERP-13P1-R

  • AI
    The **MERP-13P1-R** is a high-performance, shielded power inductor typically manufactured by **ITG Electronics**. It is designed for high-density power applications, specifically in DC-DC converters and voltage regulator modules (VRMs). --- ### 1. Key Technical Specifications The following table highlights the primary electrical characteristics of the MERP-13P1 series (with specific focus on common R-series values): | Parameter | Typical Value | Notes | | :--- | :--- | :--- | | **Inductance** | ~0.10 µH to 0.50 µH | Depends on specific sub-code | | **Tolerance** | ±10% to ±20% | Standard manufacturing tolerance | | **DCR (Direct Current Resistance)** | < 0.30 mΩ | Extremely low to minimize power loss | | **Isat (Saturation Current)** | 60A - 100A+ | High current handling capability | | **Irms (Heating Current)** | 40A - 60A | Based on temperature rise (ΔT=40°C) | | **Operating Temperature** | -55°C to +125°C | Industrial grade | --- ### 2. Core Features * **Molded Construction:** The "MERP" prefix often refers to a molded metal powder core. This design provides a "soft" saturation characteristic, meaning the inductance doesn't drop off sharply when the current increases. * **Shielded Design:** The magnetic powder encapsulates the coil, providing excellent Magnetic Interference (EMI) shielding. * **High Efficiency:** Because of the exceptionally low DCR (milli-ohms), these parts are highly efficient at converting power with minimal heat dissipation. * **SMD Packaging:** Designed for automated surface-mount assembly with robust solder pads to handle high-current thermal stress. --- ### 3. Application Use-Cases The MERP-13P1-R is commonly found in environments where high current is required in a small footprint: 1. **Server and Storage:** Used in the power stages of data center CPUs and GPUs. 2. **Graphics Cards:** High-end VRMs for high-wattage video cards. 3. **Telecom Systems:** Distributed power architectures. 4. **Notebooks:** High-performance gaming laptop power rails. --- ### 4. Part Number Breakdown (Generalized) While manufacturers vary slightly, the code generally follows this logic: * **MERP:** Series identifier (Molded Energy Related Power). * **13:** Physical size/footprint (approx. 13mm width). * **P1:** Profile or revision indicator. * **R:** Usually denotes the specific Inductance value or "RoHS" compliance depending on the catalog.
    ✨ Follow-up Questions
    • ⤷ What are the exact physical dimensions of the MERP-13P1-R footprint?
    • ⤷ How does the 'soft saturation' of a molded inductor compare to ferrite cores?
    • ⤷ What is the recommended reflow soldering profile for this component?