The **M9346-RDS3T** is a high-performance, radiation-hardened memory module, specifically a **64Mb Static RAM (SRAM)** organized as 4M x 16-bit. It is manufactured by **Micross Components** (formerly part of the Austin Semiconductor line) and is designed for extreme environments like space, aerospace, and defense. --- ### 1. Key Technical Specifications The following table summarizes the primary electrical characteristics of the M9346-RDS3T: | Parameter | Specification | | :--- | :--- | | **Memory Capacity** | 64 Megabit (64Mb) | | **Organization** | 4M x 16-bit | | **Voltage Supply (Vcc)** | 3.3V (Typical) | | **Access Time** | 20ns / 25ns / 35ns (varies by grade) | | **Package Type** | 68-pin Ceramic Quad Flatpack (CQFP) | | **Interface** | Parallel Async SRAM | --- ### 2. Core Electronic Components & Features #### A. Radiation Hardening (Rad-Hard) The "RDS" in the part number typically signifies **Radiation Data Storage**. This part is engineered to withstand: * **TID (Total Ionizing Dose):** High tolerance to cumulative radiation exposure. * **SEL (Single Event Latch-up):** Immune to latch-up caused by heavy ions. * **SEU (Single Event Upset):** Designed with hardened cells to prevent bit-flips in cosmic environments. #### B. Architectural Design The module uses a multi-chip architecture integrated into a single high-reliability package. * **Asynchronous Interface:** Does not require a clock signal; data is accessed via address lines and control signals (`/CE`, `/OE`, `/WE`). * **Low Power Consumption:** Uses CMOS technology to maintain low standby current, critical for satellite power budgets. * **Byte Control:** Includes Lower Byte (`/LB`) and Upper Byte (`/UB`) enable pins to allow 8-bit or 16-bit data operations. #### C. Environmental & Physical Build * **Ceramic Packaging:** Uses a hermetically sealed ceramic CQFP to ensure protection against moisture and thermal cycling. * **Temperature Range:** Operates across the full Military Temperature Range (-55°C to +125°C). * **Lead Finish:** Typically features gold or solder-dipped leads to prevent tin whiskering. --- ### 3. Pinout Functions (Brief) | Pin Group | Function | | :--- | :--- | | **A0 - A21** | Address inputs to select memory locations. | | **DQ0 - DQ15** | Bidirectional Data I/O lines. | | **Vcc / Vss** | Power supply (+3.3V) and Ground. | | **Control Signals** | Chip Enable (CE), Output Enable (OE), Write Enable (WE). | --- ### 4. Typical Applications Due to its robust electronic profile, the M9346-RDS3T is found in: 1. **Satellite Command Systems:** For storing flight software and telemetry data. 2. **Avionics:** Flight control computers requiring high-speed, non-volatile-like reliability. 3. **Nuclear Instrumentation:** Control systems in high-radiation zones.