The **M2PHSL-A1A-R2/Q** is a specific technical part number typically associated with **M.2 (NGFF) high-speed connectors** used in industrial and consumer electronics. These connectors are designed to interface solid-state drives (SSDs), Wi-Fi modules, and other peripheral cards with a motherboard or PCB. --- ### 1. Component Specifications The part is characterized by its physical dimensions, pin density, and electrical performance suitable for high-speed data transmission. | Feature | Description | | :--- | :--- | | **Connector Type** | M.2 (NGFF - Next Generation Form Factor) | | **Pitch** | 0.50 mm | | **Orientation** | Right Angle (Horizontal) / Surface Mount (SMT) | | **Mounting Height** | Typically low profile (varies by sub-version) | | **Keying** | Often "M" Key or "B" Key (depends on specific pinout) | | **Plating** | Gold Flash or Selective Gold plating for high conductivity | --- ### 2. Electronic Characteristics This part is engineered to handle high-frequency signals with minimal interference. * **High-Speed Signal Integrity:** Supports protocols such as PCIe Gen 3/Gen 4, SATA 3.0, and USB 3.0. * **Current Rating:** Usually rated for 0.5A per pin. * **Voltage Rating:** Typically 50V AC/DC. * **Contact Resistance:** Low milliohm range (e.g., <50mΩ) to prevent power loss. * **Operating Temperature:** Generally rated for -40°C to +85°C, making it suitable for industrial applications. --- ### 3. Structural Components The connector consists of three primary materials: 1. **Housing:** High-temperature thermoplastic (LCP - Liquid Crystal Polymer) capable of withstanding reflow soldering temperatures. 2. **Contacts:** Copper alloy for a balance of mechanical strength and electrical conductivity. 3. **Solder Pegs/Tabs:** Metal tabs on the sides that provide mechanical stability and strain relief to prevent the connector from lifting off the PCB during card insertion. --- ### 4. Application Areas * **Computing:** Laptops, NUCs, and motherboards for NVMe SSDs. * **Embedded Systems:** Industrial PCs requiring compact storage or wireless modules. * **IoT Gateways:** Used for connecting cellular (4G/5G) modems or LoRa modules. --- ### 5. Part Number Breakdown (Typical) While naming conventions vary by manufacturer (such as LOTES or Foxconn), the suffix often denotes packaging: * **R2:** Usually refers to a specific revision or a "Tape and Reel" packaging format for automated pick-and-place assembly. * **Q:** Often indicates a specific quality standard or a lead-free/halogen-free compliance marker.