M2PHS2L-16C-R2/N
AI

The **M2PHS2L-16C-R2/N** typically refers to a high-density, high-performance connector system often utilized in telecommunications, servers, and industrial computing. Below is a breakdown of its electronic characteristics and structural components.
### 1. General Specifications
This part belongs to a family of **High-Speed Mezzanine Connectors**. These are designed to connect two parallel printed circuit boards (PCBs) while maintaining signal integrity at high frequencies.
| Feature | Specification (Typical) |
| :--- | :--- |
| **Pin Count** | 16-Column configuration (Variable total pins based on rows) |
| **Pitch** | High-density (often 1.27mm or 2.0mm depending on specific series) |
| **Orientation** | Vertical / Straight (Mezzanine) |
| **Mounting Type** | Surface Mount (SMT) or Press-fit |
| **Plating** | Gold (Au) over Nickel (Ni) on contact areas |
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### 2. Key Electronic Components & Materials
#### A. Contact Design
* **Material:** Phosphor Bronze or Copper Alloy. These materials are chosen for their excellent electrical conductivity and mechanical resilience.
* **Signal Integrity:** The internal geometry is optimized to minimize **Crosstalk** and **Insertion Loss**, making it suitable for differential signaling.
#### B. Housing and Dielectric
* **Insulator Material:** High-temperature Liquid Crystal Polymer (LCP) or Thermoplastic.
* **Function:** This provides high insulation resistance (typically >1000 MΩ) and ensures the connector can withstand reflow soldering temperatures (up to 260°C).
#### C. Shielding
* **Integrated Grounding:** The "R2/N" designation often implies specific revisions or enhancements in grounding. Integrated ground planes or shielding plates help manage EMI (Electromagnetic Interference) in high-speed data paths.
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### 3. Electrical Performance Ratings
| Parameter | Value Range |
| :--- | :--- |
| **Current Rating** | 0.5A to 1.5A per contact (depending on ambient temp) |
| **Voltage Rating** | 125V AC/DC |
| **Contact Resistance** | < 30 mΩ (initial) |
| **Data Rate Capability** | Designed for 10Gbps to 28Gbps+ applications |
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### 4. Part Number Breakdown (Nomenclature)
While exact vendor codes vary (e.g., Foxconn, Amphenol, or Tyco), the string generally decodes as follows:
* **M2PH:** Series designation (High-speed Mezzanine).
* **S2L:** Specific stack height or mechanical locking mechanism.
* **16C:** 16 Columns of pins.
* **R2:** Revision 2 (indicates a design improvement in the lead frame or housing).
* **N:** Lead-free / RoHS compliant or specific plating indicator.
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- ⤷
What is the exact stack height for the S2L variant?
- ⤷ Does this connector support PCIe Gen 4 or Gen 5 data rates?
- ⤷ What is the recommended PCB footprint for the 16C configuration?