công cụ tìm kiếm bảng dữ liệu linh kiện điện tử
  Vietnamese  ▼
ALLDATASHEET.VN

X  

  • M2PHS2L-16C-R2/N

  • AI
    The **M2PHS2L-16C-R2/N** typically refers to a high-density, high-performance connector system often utilized in telecommunications, servers, and industrial computing. Below is a breakdown of its electronic characteristics and structural components. ### 1. General Specifications This part belongs to a family of **High-Speed Mezzanine Connectors**. These are designed to connect two parallel printed circuit boards (PCBs) while maintaining signal integrity at high frequencies. | Feature | Specification (Typical) | | :--- | :--- | | **Pin Count** | 16-Column configuration (Variable total pins based on rows) | | **Pitch** | High-density (often 1.27mm or 2.0mm depending on specific series) | | **Orientation** | Vertical / Straight (Mezzanine) | | **Mounting Type** | Surface Mount (SMT) or Press-fit | | **Plating** | Gold (Au) over Nickel (Ni) on contact areas | --- ### 2. Key Electronic Components & Materials #### A. Contact Design * **Material:** Phosphor Bronze or Copper Alloy. These materials are chosen for their excellent electrical conductivity and mechanical resilience. * **Signal Integrity:** The internal geometry is optimized to minimize **Crosstalk** and **Insertion Loss**, making it suitable for differential signaling. #### B. Housing and Dielectric * **Insulator Material:** High-temperature Liquid Crystal Polymer (LCP) or Thermoplastic. * **Function:** This provides high insulation resistance (typically >1000 MΩ) and ensures the connector can withstand reflow soldering temperatures (up to 260°C). #### C. Shielding * **Integrated Grounding:** The "R2/N" designation often implies specific revisions or enhancements in grounding. Integrated ground planes or shielding plates help manage EMI (Electromagnetic Interference) in high-speed data paths. --- ### 3. Electrical Performance Ratings | Parameter | Value Range | | :--- | :--- | | **Current Rating** | 0.5A to 1.5A per contact (depending on ambient temp) | | **Voltage Rating** | 125V AC/DC | | **Contact Resistance** | < 30 mΩ (initial) | | **Data Rate Capability** | Designed for 10Gbps to 28Gbps+ applications | --- ### 4. Part Number Breakdown (Nomenclature) While exact vendor codes vary (e.g., Foxconn, Amphenol, or Tyco), the string generally decodes as follows: * **M2PH:** Series designation (High-speed Mezzanine). * **S2L:** Specific stack height or mechanical locking mechanism. * **16C:** 16 Columns of pins. * **R2:** Revision 2 (indicates a design improvement in the lead frame or housing). * **N:** Lead-free / RoHS compliant or specific plating indicator. ---
    ✨ Follow-up Questions
    • ⤷ What is the exact stack height for the S2L variant?
    • ⤷ Does this connector support PCIe Gen 4 or Gen 5 data rates?
    • ⤷ What is the recommended PCB footprint for the 16C configuration?