The **M2MS-0-R2/K** is a specialized high-speed connector assembly typically used in telecommunications, data centers, and industrial automation. It belongs to the **M2MS series**, which is designed for mezzanine-style board-to-board connections. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Product Type** | Mezzanine Connector (Surface Mount) | | **Pitch** | 0.5mm to 0.8mm (typical for M2MS series) | | **Orientation** | Vertical / Straight | | **Plating** | Gold (R2 indicates high-durability plating) | | **Termination** | SMT (Surface Mount Technology) | | **Material** | High-temperature LCP (Liquid Crystal Polymer) | --- ### 2. Breakdown of the Part Number While specific manufacturer prefixes can vary (such as I-PEX or similar high-speed brands), the suffix logic generally follows this structure: * **M2MS**: The series designation, indicating a Mezzanine Male/Plug or Socket system designed for high-density layouts. * **-0-**: Often indicates the height code (e.g., 0mm offset or standard stack height). * **R2**: Refers to the **Reel Packaging** or a specific **Revision 2** of the contact plating (often 10-15 micro-inches of gold). * **K**: Indicates **Kapton Tape** or a vacuum pick-and-place cap for automated assembly. --- ### 3. Electronic Characteristics * **Signal Integrity:** Designed for high-speed differential pairs (PCIe Gen 4/5 or 10Gbps+ Ethernet standards). * **Contact Resistance:** Extremely low (typically < 30mΩ) to ensure minimal signal loss across the board-to-board interface. * **Current Rating:** Usually rated for 0.5A to 1.0A per pin, making it suitable for signal transmission rather than high-power delivery. * **Shielding:** The "K" or "R2" variants often include metallic shielding shells to minimize Electromagnetic Interference (EMI) in compact electronic housings. --- ### 4. Common Applications 1. **Optical Modules:** Used inside SFP/QSFP transceivers to connect internal PCBs. 2. **Mobile Devices:** High-density connections in tablets or ruggedized handhelds. 3. **Embedded Systems:** Connecting "System on Modules" (SoM) to carrier boards.