The **M2CEC-26001-R** is a specific part number typically associated with high-density interconnect solutions, specifically belonging to the **M2CEC series** by manufacturers like **Yamaichi Electronics**. These are primarily used as **SO-DIMM type connectors** for mounting System-on-Modules (SoM) or computer-on-modules (CoM), such as those used with Raspberry Pi Compute Modules or industrial embedded boards. --- ### 1. Key Technical Specifications The following table outlines the general electronic and mechanical characteristics of the M2CEC-26001-R series: | Feature | Specification | | :--- | :--- | | **Pin Count** | 260 Pins | | **Pitch** | 0.50 mm | | **Connector Type** | Right Angle / Horizontal SMT | | **Voltage Rating** | 50V AC/DC | | **Current Rating** | 0.5A per pin | | **Contact Resistance** | 50 mΩ max | | **Insulation Resistance** | 100 MΩ min | | **Operating Temp** | -40°C to +85°C | --- ### 2. Major Electronic Components & Materials The construction of this part involves several high-performance materials to ensure signal integrity: 1. **Contact Base:** Usually a Copper Alloy, chosen for its balance of electrical conductivity and mechanical spring tension. 2. **Plating:** * **Contact Area:** Gold plating (to prevent oxidation and ensure low resistance over many mating cycles). * **Solder Area:** Tin or Gold flash (to facilitate easy Surface Mount Technology (SMT) soldering). 3. **Insulator Body:** High-temperature thermoplastic (LCP - Liquid Crystal Polymer). This allows the part to withstand the heat of **Lead-Free Reflow Soldering** profiles. 4. **Hardware:** Metal tabs (Stay-downs) are integrated into the sides to provide mechanical strain relief to the PCB solder joints. --- ### 3. Application Use Cases The M2CEC-26001-R is designed for high-speed differential signaling. It is commonly found in: * **Embedded Computing:** Carrying PCIe, HDMI, and USB signals from a module to a carrier board. * **DDR4 SDRAM Interface:** Since it uses the 260-pin standard, it is physically compatible with DDR4 SO-DIMM layouts. * **Networking Gear:** Used in routers or switches where a modular processor board is required for easy upgrades. --- ### 4. Footprint Example (Generic SMT) While specific footprints depend on the CAD library, the general SMT layout follows this logic: ```c /* Representation of the 0.5mm Pitch SMT Pads */ [ Pad 1 ] [ Pad 3 ] [ Pad 5 ] ... [ Pad 259 ] --------------------------------------------- (Plastic Housing / Alignment Pegs) --------------------------------------------- [ Pad 2 ] [ Pad 4 ] [ Pad 6 ] ... [ Pad 260 ] ```