The **M2CEC-25001-R** is a specialized electronic component, typically categorized as a **high-speed edge card connector** or a **Mezzanine connector**, often associated with standardized modular computing architectures like COM-HPC or similar high-performance interfaces. Below is a detailed breakdown of its electronic and mechanical characteristics. --- ### 1. General Specifications The part is designed for high-density signal integrity and reliability in demanding computing environments. | Feature | Specification (Typical) | | :--- | :--- | | **Component Type** | Board-to-Board / Edge Card Connector | | **Pin Count** | 400 Pins (Standard for high-end modules) | | **Pitch** | 0.50 mm or 0.60 mm | | **Mounting Type** | Surface Mount (SMT) | | **Data Rates** | Support for PCIe Gen 5 / 100GbE | | **RoHS Status** | Compliant (Indicated by the "-R" suffix) | --- ### 2. Key Electronic Features #### A. Signal Integrity * **High Frequency:** Engineered to minimize crosstalk and insertion loss, making it suitable for differential signaling used in high-speed data buses. * **Impedance Matching:** Usually designed for **85Ω or 100Ω** differential impedance to match CPU/GPU trace requirements. #### B. Power Delivery * **Current Rating:** While primarily for signals, specific pins are designated for power delivery, often rated between **0.5A to 1.0A per pin** depending on the thermal dissipation of the PCB. * **Voltage Rating:** Typically rated for **50V to 125V AC/DC**. #### C. Contact Material * The contacts are usually made of a **Copper Alloy** with **Gold Plating** on the mating area to ensure low contact resistance and prevent oxidation over long-term use. --- ### 3. Application Use Cases This part is commonly found in the following electronic assemblies: * **COM-HPC (Computer-on-Module):** Used to connect a high-performance processor module to a carrier board. * **Edge Servers:** Handling massive I/O throughput for networking. * **AI Accelerators:** Connecting TPU/NPU modules to main logic boards. * **Industrial Automation:** High-reliability modules that require secure, vibration-resistant connections. --- ### 4. Technical Drawing Overview | Segment | Description | | :--- | :--- | | **Housing** | High-temperature thermoplastic (LCP), capable of withstanding lead-free reflow soldering temperatures. | | **Polarization** | Keyed features to prevent incorrect orientation (mating) during assembly. | | **Shielding** | Integrated ground planes to provide EMI (Electromagnetic Interference) protection. |