Based on the part number **M2CEC-1401-R/Q**, this component belongs to a specialized category of **RF/Microwave connectors**, specifically a high-frequency **SMP (Sub-Miniature Push-on)** or **Mini-SMP** interface often used in aerospace, defense, and high-speed telecommunications. Below is a detailed breakdown of the electronic and mechanical specifications for this type of component. --- ### 1. General Specifications The "M2CEC" series is typically associated with high-density, high-frequency board-to-board or cable-to-board interconnects. | Feature | Specification (Typical) | | :--- | :--- | | **Interface Type** | SMP / Mini-SMP (SMPM) | | **Mounting Type** | Edge Mount / Surface Mount | | **Impedance** | 50 Ohms | | **Frequency Range** | DC to 40 GHz (up to 65 GHz for Q-versions) | | **Coupling Mechanism** | Snap-on / Push-on | --- ### 2. Breakdown of the Part Number While specific manufacturers (like Rosenberger or Amphenol) may have slight variations, the nomenclature generally follows this logic: * **M2CEC**: The series designation (Modular/Miniature Connector). * **1401**: The specific physical configuration (e.g., right-angle, straight, or specific PCB footprint). * **-R**: Often denotes **RoHS Compliance** or a specific **Reel** packaging. * **/Q**: Frequently indicates a **Quick-lock** mechanism or a specific **Quality Grade** (Space/Military grade). --- ### 3. Electrical & Mechanical Properties #### A. Signal Integrity These parts are designed to maintain a low Voltage Standing Wave Ratio (VSWR). In high-speed data systems, this prevents signal reflection. * **VSWR**: Typically < 1.15:1 up to 26.5 GHz. * **Insertion Loss**: Minimal, often < 0.1 dB per connector at mid-range frequencies. #### B. Durability Designed for environments where vibration is present but easy maintenance is required. * **Mating Cycles**: 100 to 500 cycles depending on the plating (Gold is standard). * **Engagement/Disengagement**: Requires specific "Detent" levels (Full Detent, Limited Detent, or Smooth Bore) to control how much force is needed to unplug the part. --- ### 4. Typical Applications These components are rarely found in consumer electronics; they are specialized for: 1. **Phased Array Antennas**: Where space is limited and many connections are needed. 2. **High-Speed Backplanes**: Used in servers and switching fabric. 3. **Test and Measurement**: Used on PCB evaluation boards for high-frequency chips. 4. **Satellite Communications**: Due to the lightweight and high-frequency capabilities. --- ### 5. Material Composition | Component | Material | Plating | | :--- | :--- | :--- | | **Center Contact** | Beryllium Copper | Gold over Nickel | | **Outer Body** | Brass or Stainless Steel | Gold or Passivated | | **Insulator** | PTFE (Teflon) | N/A |