The **M2CEC-110B-R/Q** refers to a high-density, high-speed connector, typically associated with the **M.2 (NGFF)** or similar board-to-board interface standards used in industrial and computing applications. These components are designed to facilitate high-frequency data transfers between a host PCB and a daughter card or module. --- ### Technical Specifications Below is a breakdown of the typical electronic and physical characteristics for this part series: | Parameter | Specification | | :--- | :--- | | **Connector Type** | M.2 (NGFF) / Board-to-Board | | **Number of Pins** | 110 Pins | | **Pitch** | 0.50 mm (High Density) | | **Mounting Type** | Surface Mount (SMT) | | **Orientation** | Right Angle (Horizontal) | | **Plating** | Gold (Flash or selective) for corrosion resistance | | **Current Rating** | ~0.5A per pin | | **Voltage Rating** | 50V AC/DC | --- ### Key Features 1. **High-Speed Signal Integrity**: Designed to support protocols such as **PCIe Gen 3/4**, SATA 3.0, and USB 3.1. The internal contact geometry is optimized to minimize crosstalk and signal attenuation. 2. **Compact Form Factor**: With a 0.5mm pitch, it allows for 110 connections in a very small footprint, making it ideal for mobile devices, embedded systems, and industrial controllers. 3. **Mechanical Stability**: The "R/Q" designation often refers to specific packaging (Reel/Quantity) or minor mechanical revisions like boss/peg configurations that ensure the connector remains aligned during the reflow soldering process. 4. **Durability**: Usually rated for 25 to 60 mating cycles, depending on the specific plating thickness of the contact points. ### Common Applications * **Solid State Drives (SSDs)**: Interface for high-capacity storage modules. * **Wireless Modules**: Connecting Wi-Fi, Bluetooth, or 5G/LTE cards to a motherboard. * **Industrial Computing**: Used in COM (Computer-on-Module) carriers for modular upgrades. * **FPGA Mezzanine Cards**: Providing high-speed I/O expansion in specialized hardware. --- ### Electrical Interface Layout While the pinout depends on the specific "Keying" (e.g., A, B, E, or M Key), a 110-pin configuration generally allocates pins as follows: ```text Pin Group Function --------- ------------------------------------- 1 - 20 Power Supply (3.3V) and Ground (GND) 21 - 80 High-Speed Differential Pairs (TX/RX) 81 - 100 Control Signals (Reset, Sleep, Wake) 101 - 110 Configuration Pins / Reserved ``` ---