The **M2AVS-16136-R/N** is a specialized electronic component, typically categorized as a high-density, high-frequency **Micro-Coaxial Connector or Cable Assembly**, often utilized in medical imaging (like ultrasound probes) or high-end industrial sensing applications. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by manufacturers (often associated with brands like **I-PEX** or **Hirose** equivalents) to define its physical and electrical characteristics. | Feature | Specification | Description | | :--- | :--- | :--- | | **Type** | Micro-Coaxial | Designed for minimal signal loss in small form factors. | | **Pitch** | 0.4mm - 0.5mm | Extremely fine spacing between pins for high-density PCBs. | | **Pin Count** | 30 - 40 (Typical) | High pin count for multi-channel data transmission. | | **Impedance** | 50 $\Omega$ / 90 $\Omega$ | Controlled impedance for high-speed differential signaling. | | **Voltage Rating** | 30V - 100V AC/DC | Depending on the insulation material used. | --- ### 2. Key Components & Materials The construction of the M2AVS series focuses on electromagnetic interference (EMI) shielding and mechanical durability. * **Contact Material:** Usually a Copper Alloy with **Gold Plating** to prevent oxidation and ensure low contact resistance. * **Insulator:** High-temperature LCP (Liquid Crystal Polymer), allowing the part to withstand lead-free reflow soldering temperatures. * **Shell/Shielding:** Stainless steel or Tin-plated Phosphor Bronze to provide 360-degree EMI protection. * **Termination Type:** SMT (Surface Mount Technology) for the receptacle, while the plug side is often "IDC" (Insulation Displacement) for micro-coaxial wires. --- ### 3. Application Areas Because of its small footprint and high-frequency capabilities, it is found in specific industries: 1. **Medical Ultrasound:** Connecting the transducer head to the main processing unit, where hundreds of coaxial wires must fit into a handheld handle. 2. **Display Interfaces:** LVDS or eDP (Embedded DisplayPort) connections in ultra-thin laptops or tablets. 3. **Drones/Robotics:** High-definition camera feeds where weight and space are critical constraints. --- ### 4. Handling Precautions Due to the "Micro" nature of these parts, they are highly sensitive to physical damage. * **Mating Force:** Must be aligned perfectly before applying pressure; diagonal insertion can bend the micro-pins. * **Soldering:** Requires precision stencil printing; excess solder paste can cause bridging between the 0.4mm pitch pads. * **ESD:** Like most high-speed signal components, it should be handled in an ESD-safe environment to protect the connected semiconductors. ---