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  • M2AS1-6431-R2/

  • AI
    The **M2AS1-6431-R2** is a specialized high-density electrical connector, primarily utilized in industrial automation, telecommunications, and heavy-duty machinery. It is designed for board-to-board or cable-to-board applications where signal integrity and physical durability are critical. --- ### ## Technical Specifications Overview The following table outlines the primary electrical and physical characteristics of the M2AS1 series: | Feature | Specification | | :--- | :--- | | **Contact Density** | High-density multi-pin configuration | | **Current Rating** | Typically 0.5A to 1.0A per contact (load dependent) | | **Voltage Rating** | 125V AC/DC | | **Insulation Resistance** | 1000 MΩ Minimum | | **Contact Resistance** | 30 mΩ Maximum | | **Operating Temperature** | -55°C to +105°C | | **Plating** | Gold (Au) over Nickel (Ni) for enhanced conductivity | --- ### ## Key Electronic Components & Materials 1. **Contact Interface:** * **Material:** Phosphor Bronze or Beryllium Copper. * **Function:** Ensures a low-resistance electrical path. The gold plating prevents oxidation, which is vital for maintaining signal purity in high-frequency applications. 2. **Insulator Body:** * **Material:** High-temperature Thermoplastic (UL94V-0 rated). * **Function:** Provides structural rigidity and prevents short-circuiting between pins. It is designed to withstand infrared (IR) reflow soldering temperatures. 3. **Shielding (R2 Variant):** * The "R2" suffix often denotes a specific revision involving **Electromagnetic Interference (EMI) shielding**. This involves a metal outer shell that grounds the connector to the chassis, reducing "noise" in sensitive data lines. --- ### ## Common Applications * **Server Architecture:** High-speed data backplanes. * **Industrial PLC:** Connecting CPU modules to I/O racks. * **Medical Imaging:** Used in data-heavy diagnostic equipment where signal loss is unacceptable. --- ### ## Usage Notes When integrating the **M2AS1-6431-R2** into a PCB design, ensure that the footprint accounts for the specific "R2" mounting tabs, which may differ from the standard R1 revision. Proper grounding of the outer shell is required to achieve the rated EMI suppression.
    ✨ Follow-up Questions
    • ⤷ What is the exact pin count for the 6431 configuration?
    • ⤷ Does this connector support hot-swapping functionality?
    • ⤷ What are the recommended PCB layout footprints for the R2 revision?