The **M2AS1-6144-R** is a specific electronic component typically categorized as a **High-Speed/High-Density Connector** or a specialized **M.2 / PCIe interface module**, often manufactured by companies like **Amphenol** or **FCI**. Below is a breakdown of its technical characteristics and electronic properties. --- ### 1. Technical Specifications This part is designed for high-performance data transmission, commonly used in networking, servers, and storage systems. | Feature | Specification | | :--- | :--- | | **Component Type** | Mezzanine / Card Edge Connector | | **Interface Standard** | M.2 (NGFF) or PCIe compatible | | **Number of Positions** | 61 - 144 Pins (Configuration dependent) | | **Orientation** | Right-Angle or Vertical (typically Surface Mount) | | **Material** | High-temperature thermoplastic (LCP) | | **Plating** | Gold over Nickel (to prevent oxidation) | --- ### 2. Key Electronic Properties * **Signal Integrity:** Engineered for low crosstalk and minimal signal loss at high frequencies (up to 16 Gbps or higher, depending on the generation). * **Impedance Matching:** Designed to maintain a differential impedance of **85Ω to 100Ω**, which is critical for PCIe Gen 3/4/5 signals. * **Current Rating:** Typically supports around **0.5A per contact**, intended for low-power signaling rather than high-current power delivery. * **Voltage Rating:** Usually rated for **50V AC/DC**. --- ### 3. Physical & Mechanical Construction 1. **Housing:** The body is made of Liquid Crystal Polymer (LCP), which allows the part to withstand **reflow soldering** temperatures (up to 260°C). 2. **Contacts:** Copper alloy base material ensures high conductivity and mechanical spring resilience for repeated mating cycles. 3. **Mounting:** Uses **SMT (Surface Mount Technology)** pads. Some versions include "pegs" or "bosses" for mechanical alignment on the PCB during assembly. --- ### 4. Applications The M2AS1 series is frequently found in the following environments: * **Data Centers:** For connecting SSD storage modules to motherboards. * **Embedded Systems:** High-speed I/O for industrial computers. * **Telecommunications:** Base stations and switching equipment where space is limited. ---