Based on the part number **M2AS1-5411-R2/N**, this component belongs to the **M2 series** of high-speed, high-density mezzanine connectors, typically manufactured by companies like **Amphenol** or **TE Connectivity** (often used in OCP - Open Compute Project specifications). --- ### 1. General Specifications This part is a high-performance connector designed for board-to-board applications requiring high signal integrity. | Feature | Description | | :--- | :--- | | **Part Type** | Mezzanine Connector (Plug/Header) | | **Series** | M2 Series | | **Contact Density** | High Density (400+ positions typical for this series) | | **Signal Integrity** | Supports 25Gbps to 56Gbps+ (PAM4) | | **Application** | Servers, Storage, Networking, High-performance Computing | --- ### 2. Electronic Component Breakdown The alphanumeric code provides specific details regarding the physical and electrical build of the part: * **M2AS**: Refers to the **M2 High-Speed Mezzanine** family. * **1**: Usually denotes the gender (e.g., Plug or Receptacle). * **5411**: This sequence typically identifies the **Pin Count** and **Stack Height**. * *Note: In the M2 series, this often corresponds to 400 or 444 positions depending on the specific grid layout.* * **R2**: Refers to the **Revision** or a specific **Retention/Alignment** feature (like guide pins). * **N**: Often signifies **Standard plating** (Non-Gold or specific Lead-free/RoHS compliance markers). --- ### 3. Key Technical Features * **Differential Pairs:** Optimized for differential signaling with minimal crosstalk. * **Impedance Matching:** Designed for **85 Ohm or 100 Ohm** systems to match PCIE Gen 4/5 or Ethernet requirements. * **BGA Termination:** These parts usually utilize Solder Ball (BGA) attachment to the PCB for superior electrical performance at high frequencies. * **Wipe Length:** Designed with a specific contact wipe to ensure reliable connection in high-vibration environments. --- ### 4. Common Applications Due to its high bandwidth capabilities, this part is found in: 1. **OCP (Open Compute Project) Nic 3.0** cards. 2. **Accelerator Modules** (GPU to CPU interconnects). 3. **Backplane interface** for modular switches. --- ### 5. Mechanical Data Reference ```json { "Pitch": "0.5mm to 0.8mm (typical)", "Mating_Force": "Low insertion force design", "Material": "High-temperature thermoplastic", "Plating": "Gold over Nickel on contact surfaces" } ```