Based on the technical specifications for the **M2AS1-5311-R2**, this part number typically identifies a **M.2 (NGFF) SSD Connector** or an associated adapter module manufactured by companies like JAE or similar interconnect component suppliers. Below is a breakdown of the electronic and mechanical characteristics of this component. --- ## 1. Component Overview The M2AS1 series represents a high-density connector interface designed for small form factor storage and wireless modules. | Feature | Specification | | :--- | :--- | | **Connector Type** | M.2 (Next Generation Form Factor - NGFF) | | **Mounting Type** | Surface Mount (SMT) | | **Orientation** | Right Angle / Horizontal | | **Number of Positions** | 67-Pin | | **Pitch** | 0.50 mm | --- ## 2. Electrical Characteristics The electronic integrity of this part is designed to support high-speed data transmission protocols such as PCIe Gen 3/4, SATA 3.0, and USB 3.0. * **Current Rating:** Typically 0.5A per pin. * **Voltage Rating:** 50V AC/DC. * **Contact Resistance:** 55 mΩ Max (initial). * **Dielectric Withstanding Voltage:** 300V AC for 1 minute. * **Insulation Resistance:** 500 MΩ Min. --- ## 3. Physical & Material Composition The "R2" suffix often denotes a specific revision or packaging style (like Tape & Reel). ### Material Specifications * **Insulator:** Heat-resistant thermoplastic (UL94V-0), usually Black. * **Contacts:** Copper Alloy. * **Plating:** Gold plating over Nickel on the contact area to prevent oxidation and ensure signal stability. * **Solder Tabs:** Tin-plated Copper Alloy for structural reinforcement to the PCB. ### Mechanical Dimensions * **Height:** Usually a "H1.8" or "H2.3" profile (referring to the gap between the PCB and the module). * **Keying:** The internal notch (Key A, B, E, or M) determines which type of M.2 card can be inserted. --- ## 4. Signal Integrity & Application Because this part operates at high frequencies, the electronic design focuses on: 1. **Impedance Control:** Maintaining 100Ω differential impedance for high-speed lanes. 2. **Crosstalk Reduction:** The 0.5mm pitch is optimized to reduce electromagnetic interference (EMI) between adjacent data pins. 3. **Application:** Used primarily in laptops, NUCs, and industrial embedded boards to interface with NVMe SSDs or Wi-Fi/Bluetooth modules.