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  • LCMXO2-256UHC4BG256ITRES

  • AI
    The **LCMXO2-256UHC-4BG256ITRES** is a specific part number belonging to the **MachXO2** family of FPGAs (Field Programmable Gate Arrays) manufactured by **Lattice Semiconductor**. These devices are categorized as "Bridging and I/O Expansion FPGAs," designed for low power, high I/O density, and instant-on capabilities. --- ### Part Number Breakdown | Segment | Code | Description | | :--- | :--- | :--- | | **Family** | LCMXO2 | MachXO2 Product Family | | **Logic Density** | 256 | 256 Look-Up Tables (LUTs) | | **Voltage** | HC | High Performance / High Voltage (VCC = 2.5V to 3.3V) | | **Speed Grade** | 4 | Speed grade (Standard performance) | | **Package** | BG256 | 256-ball caBGA (Ball Grid Array) | | **Temperature** | I | Industrial Grade (-40°C to +100°C) | | **Suffix** | TRES | Specific Tape and Reel or Customer-specific variant (often "TR" for Tape/Reel) | --- ### Key Technical Specifications 1. **Logic Capacity**: * **LUTs**: 256. This is a very small, entry-level density intended for simple glue logic, state machines, or signal routing. * **User I/O**: Supports up to 206 I/O pins (depending on package utilization). 2. **Memory & Storage**: * **Embedded Flash**: Non-volatile configuration. The FPGA boots instantly (Instant-on) without needing an external SPI Flash. * **SysMEM EBR**: Embedded Block RAM for internal data storage. 3. **Power Management**: * **Ultra-Low Power**: Optimized for standby modes. * **Voltage**: The "HC" variant operates with a 2.5V or 3.3V core power supply, making it easier to integrate into systems without needing dedicated 1.2V regulators. 4. **Hardened IP (Hard Macros)**: * Includes hardened **I2C, SPI, and Timer/Counter** blocks, which saves logic cells for other tasks. --- ### Typical Applications Because of its small footprint and low logic density, this part is commonly used for: * **Power Sequencing**: Managing the startup of complex CPUs or SOCs. * **Level Shifting**: Translating signals between different voltage domains (e.g., 1.8V to 3.3V). * **I/O Expansion**: Adding extra GPIO, I2C, or SPI ports to a microcontroller that has run out of pins. * **Interface Bridging**: Converting simple protocols like UART to SPI or custom bus interfaces. --- ### Hardware Design Considerations ```yaml Design_Tips: - Power_Supplies: Ensure clean VCC and VCCIO rails. - Configuration: Supports JTAG, SPI, and I2C programming. - Thermal: The BG256 package requires careful PCB thermal pad design for industrial environments. - Software: Use Lattice Diamond design software for synthesis and routing. ```
    ✨ Follow-up Questions
    • ⤷What is the difference between the 'HC' and 'ZE' variants in the MachXO2 family?
    • ⤷ How do I program the internal Flash of the LCMXO2-256?
    • ⤷ What is the maximum clock frequency supported by this speed grade?