The **LCMXO2-2000HC-4MG132C** is a non-volatile Field Programmable Gate Array (FPGA) from the **MachXO2 family** by Lattice Semiconductor. It is specifically designed for low-power, instant-on applications such as system control, bus bridging, and I/O expansion. --- ### 1. Key Technical Specifications The part number encodes specific characteristics of the device. Here is the breakdown of its primary technical parameters: | Parameter | Specification | |:---|:---| | **Logic Cells** | 2,112 Look-up Tables (LUTs) | | **User I/O Count** | 104 I/Os | | **Embedded Block RAM** | 74 Kbits | | **User Flash Memory** | 64 Kbits | | **Voltage Supply (Core)** | 2.5V to 3.3V | | **Package Type** | csBGA-132 (Chip Scale Ball Grid Array) | | **Speed Grade** | -4 (Standard Speed) | | **Temperature Range** | 0°C to 85°C (Commercial Grade) | --- ### 2. Functional Architecture The MachXO2 architecture is unique because it combines the flexibility of an FPGA with the configuration ease of a CPLD (Complex Programmable Logic Device). * **Embedded Function Blocks (EFB):** It contains hardened IP for common interfaces, including **I2C, SPI, and Timer/Counters**, which saves logic cells for other tasks. * **Instant-On Performance:** Because it features on-chip Flash memory, the device configures itself in microseconds upon power-up, eliminating the need for an external boot PROM. * **Low Power Design:** The "HC" series utilizes a high-performance/low-power process technology, making it suitable for handheld or battery-operated devices. --- ### 3. Pinout and Physical Characteristics The **MG132** package code refers to the 132-ball Chip Scale BGA. This is a very small footprint (approximately 8x8 mm), ideal for space-constrained PCB designs. ```text Package: csBGA-132 Pitch: 0.5mm Dimensions: 8mm x 8mm Ball Arrangement: 11 x 11 matrix (approx) ``` --- ### 4. Part Number Breakdown To better understand the ordering code: * **LCMXO2**: MachXO2 Product Family. * **2000**: Density (approx. 2000 LUTs). * **HC**: High-performance (2.5V/3.3V) / Low Power. * **4**: Speed Grade (4 is standard; 6 is faster). * **MG132**: 132-ball csBGA package. * **C**: Commercial Temperature grade. --- ### 5. Common Applications * **Interface Bridging:** Converting signals between different logic levels or protocols (e.g., I2C to Parallel). * **I/O Expansion:** Adding more GPIOs to a microcontroller that has run out of pins. * **Power Sequencing:** Managing the power-up timing of various rails on a complex motherboard. * **Sensor Hubs:** Aggregating data from multiple low-speed sensors before sending it to a main Application Processor.