IS25LP064A-RHLA1
AI

The **IS25LP064A-RHLA1** is a high-performance 64-Megabit (8 MB) Serial Flash Memory manufactured by Integrated Silicon Solution Inc. (ISSI). It is designed for high-speed systems that require reliable non-volatile storage.
---
### 1. Key Technical Specifications
| Parameter | Specification |
| :--- | :--- |
| **Memory Capacity** | 64 Megabits (8 Megabytes) |
| **Interface** | SPI, Dual SPI, Quad SPI, and QPI |
| **Clock Frequency** | Up to 133 MHz (Standard/Dual/Quad SPI) |
| **Operating Voltage** | 2.3V to 3.6V |
| **Temperature Range** | Industrial: -40°C to +85°C |
| **Package Type** | 24-ball TFBGA (6x8mm) |
| **Data Retention** | 20 Years |
---
### 2. Functional Features
* **Multi-I/O Support:** It supports standard Serial Peripheral Interface (SPI), as well as Dual/Quad I/O modes. Quad SPI (QSPI) allows for a theoretical throughput of up to 532 Mbps.
* **High Speed Read:** Supports "Fast Read" and DTR (Double Transfer Rate) modes, enabling data to be read on both edges of the clock.
* **Flexible Architecture:**
* Uniform 4KB sectors.
* Uniform 32KB/64KB blocks.
* **Low Power Consumption:**
* Active Read Current: ~12mA (at 133MHz).
* Deep Power Down: < 5µA (typical).
---
### 3. Pinout Configuration (24-Ball TFBGA)
The "RHLA1" suffix indicates a specific ball grid array layout. Below is the general functional mapping for this package:
| Ball Designation | Name | Function |
| :--- | :--- | :--- |
| **C2** | VCC | Power Supply |
| **D3** | GND | Ground |
| **B2** | CE# | Chip Enable (Active Low) |
| **D2** | SO (IO1) | Serial Data Output / IO1 |
| **D1** | SI (IO0) | Serial Data Input / IO0 |
| **C1** | SCK | Serial Clock |
| **C4** | WP# (IO2) | Write Protect / IO2 |
| **C3** | HOLD# (IO3) | Hold or Reset / IO3 |
---
### 4. Part Number Decoder (IS25LP064A-RHLA1)
Understanding the nomenclature helps in identifying the exact variant:
* **IS**: ISSI (Manufacturer).
* **25LP**: Product Family (2.5V/3V Ultra-Low Power Serial Flash).
* **064**: Density (64 Megabits).
* **A**: Revision / Product Version.
* **RH**: Package Type (24-ball TFBGA, 6x8mm).
* **L**: Temperature Grade (Industrial -40°C to +85°C).
* **A1**: Automotive Grade / Special Processing (Optional indicator).
---
### 5. Common Applications
* **Embedded Systems:** Storing boot code and firmware for microcontrollers.
* **Automotive:** Infotainment systems and instrument clusters.
* **Networking:** Storage for routers, switches, and gateways.
* **Industrial:** Programmable Logic Controllers (PLCs) and HMI panels.
- ⤷
What are the differences between the IS25LP and IS25WP series?
- ⤷ How do you implement the Quad SPI mode in firmware for this chip?
- ⤷ What are the specific timing requirements for the Write Enable (WREN) command?