The **G3B25AH-R-YA** is a high-quality, subminiature push-button switch manufactured by **NKK Switches**. It belongs to the **G3B Series**, which is specifically designed for surface-mount technology (SMT) and high-density PCB packaging. --- ### 1. General Specifications Below is a breakdown of the primary technical characteristics for this specific part number. | Feature | Specification | | :--- | :--- | | **Circuit** | DPDT (Double Pole Double Throw) | | **Switch Function** | On-(On) / Momentary (Spring return to rest position) | | **Current Rating** | 0.4VA Max @ 28V AC/DC (Logic Level) | | **Mounting Type** | Surface Mount, Right Angle | | **Actuator Type** | Standard Plunger | | **Cap Color** | Black (indicated by the suffix) | | **Illumination** | Non-Illuminated | --- ### 2. Part Number Breakdown Understanding the nomenclature helps identify the physical and electrical attributes: * **G3B**: Series identifier (Ultra-miniature SMT Pushbuttons). * **25**: Circuit code for **DPDT**. * **A**: Actuator style (Standard). * **H**: Terminal type (Right Angle, Through-hole style formed for SMT). * **R**: Packaging (Tape and Reel). * **YA**: Accessory code (typically refers to the black cap/button color). --- ### 3. Key Electronic & Mechanical Features #### A. Logic Level Application The device is rated for **0.4VA max**. This means it is designed strictly for logic-level switching (interfacing with microcontrollers or ICs) rather than power switching. Using it for high-current applications will damage the gold-plated contacts. #### B. Contact Reliability * **Gold Contacts:** It uses gold-plated contacts to ensure high reliability in low-voltage circuits and to prevent oxidation. * **Heat Resistance:** The housing is made of high-temperature resin (Polyphenylene Sulfide), allowing it to withstand infrared (IR) and vapor phase reflow soldering processes. #### C. Environmental Sealing The G3B series features a **washable** construction. It utilizes an internal o-ring and ultrasonic welding to prevent flux, solvents, and other contaminants from entering the switch mechanism during the cleaning process after soldering. --- ### 4. Typical Applications * Handheld medical devices. * Telecommunications equipment. * Industrial automation control panels. * High-density computer peripherals.