DFE252010P-R47M
AI

## Technical Overview: DFE252010P-R47M
The **DFE252010P-R47M** is a high-performance, miniature metal alloy inductor manufactured by **Murata Electronics**. It is specifically designed for power circuits in space-constrained environments like smartphones, tablets, and wearable technology.
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### 1. Key Technical Specifications
| Parameter | Specification | Notes |
| :--- | :--- | :--- |
| **Inductance** | 0.47 µH | Measured at 1MHz |
| **Tolerance** | ±20% (M) | Standard industry tolerance |
| **DC Resistance (DCR)** | 27 mΩ (Max) | 21 mΩ (Typ) |
| **Rated Current (Isat)** | 5.0 A | Based on 30% inductance drop |
| **Rated Current (Itemp)** | 3.9 A | Based on 40°C temperature rise |
| **Operating Temp** | -40°C to +125°C | Includes self-heating |
| **Case Size (EIA)** | 1008 | 2.5 x 2.0 x 1.0 mm |
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### 2. Composition and Design Features
The "DFE" series utilizes specific construction techniques to balance size and efficiency:
* **Metal Alloy Core:** Unlike traditional ferrite inductors, this uses a metal powder core. This allows for **Soft Saturation** characteristics, meaning the inductance decreases gradually as current increases, rather than dropping off sharply.
* **Magnetic Shielding:** The part is magnetically shielded to minimize Electromagnetic Interference (EMI), which is critical for densely packed PCBs.
* **Low Profile:** The "10" in the part number indicates a maximum height of **1.0 mm**, making it ideal for slim electronic devices.
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### 3. Part Number Breakdown
Understanding the nomenclature helps in identifying equivalent parts:
| Code | Meaning | Description |
| :--- | :--- | :--- |
| **DFE** | Series Name | Metal alloy, low profile inductor |
| **2520** | Dimensions | 2.5mm x 2.0mm |
| **10** | Height | 1.0mm maximum |
| **P** | Internal Code | Manufacturing process indicator |
| **R47** | Inductance Value | R47 = 0.47 Microhenries (µH) |
| **M** | Tolerance | M = ±20% |
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### 4. Common Applications
* **DC-DC Converters:** Used in point-of-load (POL) modules for CPU/GPU power.
* **Mobile Devices:** Power management ICs (PMIC) in smartphones.
* **IoT Modules:** Compact wireless sensors requiring efficient power regulation.
* **Infotainment:** Low-power automotive auxiliary systems.
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- ⤷
How does a metal alloy core differ from a ferrite core in terms of performance?
- ⤷ What are the recommended landing patterns for soldering this 1008 size component?
- ⤷ Are there automotive-grade (AEC-Q200) versions of this specific inductor?