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  • DFE252010P-R47M

  • AI
    ## Technical Overview: DFE252010P-R47M The **DFE252010P-R47M** is a high-performance, miniature metal alloy inductor manufactured by **Murata Electronics**. It is specifically designed for power circuits in space-constrained environments like smartphones, tablets, and wearable technology. --- ### 1. Key Technical Specifications | Parameter | Specification | Notes | | :--- | :--- | :--- | | **Inductance** | 0.47 µH | Measured at 1MHz | | **Tolerance** | ±20% (M) | Standard industry tolerance | | **DC Resistance (DCR)** | 27 mΩ (Max) | 21 mΩ (Typ) | | **Rated Current (Isat)** | 5.0 A | Based on 30% inductance drop | | **Rated Current (Itemp)** | 3.9 A | Based on 40°C temperature rise | | **Operating Temp** | -40°C to +125°C | Includes self-heating | | **Case Size (EIA)** | 1008 | 2.5 x 2.0 x 1.0 mm | --- ### 2. Composition and Design Features The "DFE" series utilizes specific construction techniques to balance size and efficiency: * **Metal Alloy Core:** Unlike traditional ferrite inductors, this uses a metal powder core. This allows for **Soft Saturation** characteristics, meaning the inductance decreases gradually as current increases, rather than dropping off sharply. * **Magnetic Shielding:** The part is magnetically shielded to minimize Electromagnetic Interference (EMI), which is critical for densely packed PCBs. * **Low Profile:** The "10" in the part number indicates a maximum height of **1.0 mm**, making it ideal for slim electronic devices. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying equivalent parts: | Code | Meaning | Description | | :--- | :--- | :--- | | **DFE** | Series Name | Metal alloy, low profile inductor | | **2520** | Dimensions | 2.5mm x 2.0mm | | **10** | Height | 1.0mm maximum | | **P** | Internal Code | Manufacturing process indicator | | **R47** | Inductance Value | R47 = 0.47 Microhenries (µH) | | **M** | Tolerance | M = ±20% | --- ### 4. Common Applications * **DC-DC Converters:** Used in point-of-load (POL) modules for CPU/GPU power. * **Mobile Devices:** Power management ICs (PMIC) in smartphones. * **IoT Modules:** Compact wireless sensors requiring efficient power regulation. * **Infotainment:** Low-power automotive auxiliary systems. ---
    ✨ Follow-up Questions
    • ⤷ How does a metal alloy core differ from a ferrite core in terms of performance?
    • ⤷ What are the recommended landing patterns for soldering this 1008 size component?
    • ⤷ Are there automotive-grade (AEC-Q200) versions of this specific inductor?