The **CTSPMA3010F-R47M** is a high-performance, surface-mount (SMD) power inductor. It belongs to a category of molded power inductors designed for high-current applications where space is limited and electromagnetic interference (EMI) needs to be minimized. --- ### 1. Part Number Breakdown Understanding the alphanumeric code helps identify its core specifications: | Segment | Meaning | Description | | :--- | :--- | :--- | | **CTSPMA** | Series Name | Metal Alloy Molded Power Inductor series. | | **3010** | Dimensions | Approx. 3.0mm x 3.0mm x 1.0mm. | | **F** | Designator | Manufacturer internal production/material code. | | **R47** | Inductance | **0.47 µH** (R denotes the decimal point). | | **M** | Tolerance | **±20%** (Standard for power inductors). | --- ### 2. Technical Specifications The "Molded" construction refers to the coil being embedded in a metallic iron powder core, which provides superior magnetic shielding. | Parameter | Value (Typical) | | :--- | :--- | | **Inductance** | 0.47 µH | | **DC Resistance (DCR)** | ~25 - 33 mΩ (Max) | | **Saturation Current (Isat)** | ~5.0A - 6.5A (Typical) | | **Heating Current (Irms)** | ~3.5A - 4.5A (Typical) | | **Operating Temperature** | -40°C to +125°C | | **Package/Case** | 3030 (Metric) / 1212 (Imperial) | --- ### 3. Key Features & Benefits * **Low Profile:** With a height of only 1.0mm, it is ideal for ultra-thin electronics like smartphones and tablets. * **High Saturation:** The metal alloy core allows for a "soft" saturation characteristic, meaning the inductance doesn't drop abruptly when high current spikes occur. * **Magnetic Shielding:** Because the coil is molded into the core material, leakage flux is significantly reduced, preventing interference with nearby components. * **Low DCR:** Efficient design minimizes power loss (heat) during operation. --- ### 4. Common Applications This part is typically found in the **DC-DC Converter** stages of modern electronics: 1. **Mobile Devices:** Smartphones, tablets, and wearables. 2. **Computing:** Laptops and SSD (Solid State Drive) power rails. 3. **IoT Modules:** High-efficiency power management for wireless sensors. 4. **Automotive Electronics:** Used in infotainment or ADAS systems (if AEC-Q200 qualified). ---