công cụ tìm kiếm bảng dữ liệu linh kiện điện tử
  Vietnamese  ▼
ALLDATASHEET.VN

X  

  • CTMC1210F-R18M

  • AI
    ## Analysis of the CTMC1210F-R18M Electronic Component The **CTMC1210F-R18M** is a surface-mount (SMD) wire-wound chip inductor. It is designed for use in power circuits, signal lines, and high-frequency applications where stability and small footprints are required. ### 1. Part Number Breakdown Understanding the nomenclature helps identify the component's physical and electrical properties: | Part Segment | Meaning | Details | | :--- | :--- | :--- | | **CTMC** | Series Code | Molded Chip Inductor (Wire-wound) | | **1210** | Case Size | 1210 Imperial (3.2mm x 2.5mm) | | **F** | Lead-Free | RoHS Compliant / Ferrite Core | | **R18** | Inductance Value | 0.18 µH (Microhenries) | | **M** | Tolerance | ±20% | --- ### 2. Technical Specifications The following table outlines the typical electrical characteristics for this specific model: | Parameter | Value | | :--- | :--- | | **Inductance** | 0.18 µH | | **Tolerance** | ±20% | | **Quality Factor (Q) Min** | 28 (at test frequency) | | **SRF (Self-Resonant Frequency) Min** | 400 MHz | | **DCR (DC Resistance) Max** | 0.17 Ω | | **Rated Current (Idc)** | 600 mA | | **Operating Temperature** | -40°C to +125°C | --- ### 3. Key Features & Construction * **Wire-wound Structure:** Offers higher current carrying capacity and lower DC resistance compared to multilayer inductors. * **Molded Shielding:** The ferrite core and molded construction provide magnetic shielding, reducing electromagnetic interference (EMI) with surrounding components. * **Solderability:** Features excellent terminal strength and heat resistance, making it suitable for flow and reflow soldering. * **Compact Size:** The 1210 footprint is ideal for high-density PCB designs in consumer electronics. --- ### 4. Common Applications This component is typically found in: 1. **DC-DC Converters:** Used for energy storage and filtering in power management modules. 2. **Signal Decoupling:** Used to filter high-frequency noise from power supply lines. 3. **Communication Equipment:** Found in mobile phones, base stations, and networking hardware. 4. **Consumer Electronics:** Used in TVs, video cameras, and portable media players.
    ✨ Follow-up Questions
    • ⤷What is the difference between this wire-wound inductor and a multilayer inductor?
    • ⤷ Can you provide the footprint dimensions for a 1210 package?
    • ⤷ How does the SRF affect the performance of this inductor in high-frequency circuits?