The **CRA2010-FZ-R045ELF** is a high-power, low-resistance chip resistor manufactured by **Bourns**. It is specifically designed for current sensing applications where precision and thermal stability are critical. ### 1. Technical Specifications Below is a breakdown of the core technical parameters for this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Bourns | | **Series** | CRA2010 (High Power Thick Film) | | **Resistance Value** | 0.045 Ohms (45 mΩ) | | **Tolerance** | ±1% (F) | | **Power Rating** | 1.0 Watt | | **Temperature Coefficient (TCR)** | ±100 ppm/°C | | **Package / Case** | 2010 (5025 Metric) | | **Termination Material** | Tin (Sn) / Lead-Free (RoHS Compliant) | --- ### 2. Part Number Decoding Understanding the nomenclature helps in identifying the exact characteristics: * **CRA**: Series identifier (High power thick film chip resistor). * **2010**: Package size (2.0 inches x 1.0 inches nominal, or 5.0mm x 2.5mm). * **FZ**: * **F**: 1% Tolerance. * **Z**: High power rating / TCR characteristic. * **R045**: Resistance value ($R = \text{Decimal point}$). $R045 = 0.045\Omega$. * **E**: Embossed plastic tape packaging. * **LF**: Lead-Free (RoHS compliant). --- ### 3. Key Features and Applications #### Key Features * **Low Resistance:** At 45mΩ, it minimizes power loss while allowing for accurate current measurement. * **High Power Density:** The 2010 footprint supports up to 1 Watt, which is significantly higher than standard 2010 resistors. * **Durability:** Built with a robust thick film element on a ceramic substrate. #### Common Applications 1. **Current Sensing:** Used in power supplies to monitor the current flow by measuring the voltage drop across the resistor ($V = I \times R$). 2. **Battery Management Systems (BMS):** Monitoring charge/discharge cycles in Li-ion packs. 3. **Motor Control:** Feedback loops for industrial motors. 4. **DC-DC Converters:** Sensing output current for over-current protection. --- ### 4. Footprint and Mounting The **2010 package** is a Surface Mount Device (SMD). When designing a PCB for this part, ensure large copper pads are used to act as a heat sink, as 1.0W of power dissipation can generate significant local heat. ```markdown # Recommended Land Pattern (Approximate) - Pad Width: 2.50 mm - Pad Length: 1.10 mm - Gap: 3.40 mm ```