The **ATS-X50190P-C1-R0** is a high-performance heat sink component manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, specifically designed for cooling high-power electronic components like CPUs, GPUs, and ASICs. --- ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Dimensions (L x W x H)** | 19.0mm x 19.0mm x 18.5mm | | **Material** | Aluminum (Anodized Blue) | | **Thermal Resistance** | 5.30°C/W (at 200 LFM) | | **Attachment Method** | Push-Pin (Hardware included) | | **Interface Material** | T766 (High-performance thermal phase-change) | --- ### 2. Key Electronic Cooling Features * **maxiFLOW™ Geometry:** The heat sink features a unique spread-fin design. Unlike standard straight-fin heat sinks, the fins are angled to maximize surface area and increase airflow intake, which reduces the thermal resistance between the component and the ambient air. * **Integrated Thermal Interface Material (TIM):** The unit comes pre-applied with **T766** phase-change material. This ensures low contact resistance between the electronic chip (IC) and the aluminum base without requiring external thermal paste. * **Mechanical Security:** The **C1-R0** designation indicates it uses a push-pin attachment mechanism. This provides consistent pressure (preload) on the electronic package, which is critical for maintaining thermal performance over the lifespan of the device. --- ### 3. Application Use Cases This specific part is typically used in density-constrained electronic environments: 1. **Telecommunications:** Cooling small-form-factor networking chips and switches. 2. **Embedded Systems:** Industrial PCs where vertical space is limited to 18.5mm. 3. **Power Electronics:** Managing heat in DC-DC converters or motor drivers. --- ### 4. Thermal Performance Comparison Thermal resistance decreases as airflow (Measured in Linear Feet per Minute - LFM) increases: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 5.30 | | 300 | 4.30 | | 400 | 3.70 | | 500 | 3.30 |