The **ATS-P2-98-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** product line, designed for high-efficiency cooling in constrained spaces. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (with Blue Anodized finish) | | **Dimensions** | 45mm x 45mm x 15mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 15.29°C/W (at 1.0 m/s airflow) | | **Thermal Interface Material** | No TIM (Attachment only) | --- ### 2. Design Characteristics This part is engineered for specific electronic cooling requirements: * **maxiFLOW™ Geometry:** Features a tapered fin design that maximizes surface area and increases air turbulence, significantly improving heat dissipation compared to standard straight-fin heat sinks. * **pushPIN™ Attachment:** The "-R0" suffix indicates a specific mounting kit. The pushPIN™ mechanism ensures even pressure across the electronic component (CPU, GPU, or ASIC) to optimize thermal contact. * **Material and Coating:** Made of lightweight aluminum. The blue anodized finish provides corrosion resistance and increased emissivity for better radiative heat transfer. --- ### 3. Electronic Applications The ATS-P2-98-C1-R0 is typically used in the following electronic environments: * **Integrated Circuits (ICs):** Cooling high-speed processors or FPGAs. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators in power supplies. * **Telecommunications:** Used in line cards and base station hardware where airflow is directional. * **Automotive:** Found in control units that require robust mechanical attachment due to vibration. ---