ATS-P2-97-C1-R0
AI

The **ATS-P2-97-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** product series, known for its unique flared fin geometry.
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### 1. Key Technical Specifications
| Parameter | Specification |
| :--- | :--- |
| **Part Number** | ATS-P2-97-C1-R0 |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ |
| **Thermal Resistance** | 20.30 °C/W (Unducted Flow @ 200 LFM) |
| **Dimensions (L x W x H)** | 45mm x 45mm x 10mm |
| **Compliance** | RoHS-6 and REACH compliant |
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### 2. Design Features
#### A. flared Fin Geometry
The standout feature of the `maxiFLOW™` design is the outward-flared fins. This increases the surface area for heat dissipation and reduces the pressure drop, allowing for better airflow across the component compared to standard straight-fin heat sinks.
#### B. pushPIN™ Attachment
Instead of using messy thermal adhesives or tapes, this model uses a **pushPIN™** system.
* **Hardware:** It typically includes a brass or plastic pin with a stainless steel spring.
* **Installation:** It requires pre-drilled holes in the PCB. This ensures a consistent, high-pressure contact between the heat sink and the electronic component (CPU, GPU, or FPGA), maximizing thermal transfer.
#### C. Thermal Interface Material (TIM)
The "C1" in the part number indicates the type of Thermal Interface Material pre-applied to the base.
* **Material:** Generally an **ATS-PPS-01** (or similar high-performance phase-change material).
* **Benefit:** This ensures there are no air gaps between the heat source and the aluminum base.
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### 3. Electronic Applications
This specific heat sink is designed for low-profile applications where vertical space is limited (10mm height) but high thermal efficiency is required. Common use cases include:
1. **Telecommunications:** Network switches and high-speed routers.
2. **Embedded Systems:** Industrial PCs and automation controllers.
3. **Power Electronics:** Voltage regulators and power modules that generate concentrated heat.
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- ⤷
What are the advantages of flared fins over straight fins in thermal management?
- ⤷ How do I calculate the correct hole pitch on a PCB for the pushPIN attachment?
- ⤷ What is the difference between the C1 and C2 versions of this heat sink?