The **ATS-P2-88-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the "maxiFLOW™" series, designed for cooling electronic components such as processors, FPGAs, and ASICs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-P2-88-C1-R0 | | **Material** | Aluminum (with Blue Anodized finish) | | **Thermal Resistance** | 2.28°C/W (at 200 LFM) | | **Dimensions (L x W)** | 36.83mm x 36.83mm | | **Height** | 17.78mm | | **Attachment Method** | pushPIN™ (Brass/Plastic pins) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Electronic Features * **maxiFLOW™ Geometry:** The heat sink features a tapered fin design that maximizes surface area and improves airflow intake. This is critical for high-density PCBs where airflow might be obstructed. * **pushPIN™ Attachment:** The "P2" in the part number indicates the specific attachment mechanism. It uses a spring-loaded push-pin system which provides consistent pressure on the electronic component, ensuring optimal thermal contact. * **Thermal Interface Material (TIM):** The **C1** designation indicates that it comes with a high-performance thermal pad (T766) pre-applied, reducing assembly time and ensuring a reliable heat transfer path from the chip to the metal. * **R0 Compliance:** This signifies that the part is RoHS (Restriction of Hazardous Substances) compliant, meeting standard environmental regulations for electronic hardware. --- ### 3. Application Use Cases The ATS-P2-88-C1-R0 is typically used in environments where electronic components generate significant heat in a small footprint: 1. **Telecommunications:** Cooling networking switches and routers. 2. **Computing:** Heat dissipation for high-speed logic devices. 3. **Industrial Controls:** Maintaining stable operating temperatures for embedded controllers. --- ### 4. Thermal Performance Comparison Below is an example of how thermal resistance changes based on airflow speed: ```text Airflow Velocity (LFM) | Thermal Resistance (°C/W) -----------------------|-------------------------- 200 (1.0 m/s) | 2.28 400 (2.0 m/s) | 1.15 600 (3.0 m/s) | 0.82 ```