ATS-P2-86-C1-R0
AI

The **ATS-P2-86-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### 1. Technical Specifications
The following table highlights the core technical characteristics of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Attachment Method** | Push-Pin (R0) |
| **Dimensions (L x W x H)** | 35mm x 35mm x 15mm |
| **Thermal Resistance** | 2.47 °C/W (at 100 LFM) |
| **Fin Pattern** | Fine Pitch (Straight Fin) |
| **Finish** | Blue Anodized |
| **Interface Material** | T766 (Thermal Interface Material pre-applied) |
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### 2. Key Electronic Features
#### A. Attachment Mechanism: pushPIN™
This part utilizes a "push-pin" system. This is a common mounting method in PCB design where a spring-loaded plastic or brass pin is pushed through pre-drilled holes in the motherboard/PCB. This ensures constant pressure between the heat sink and the electronic chip for maximum heat transfer.
#### B. Material and Conductivity
The heat sink is made from **Aluminum**, which offers a high thermal conductivity-to-weight ratio. The **Blue Anodized** finish isn't just for aesthetics; it provides surface protection against corrosion and increases emissivity for better radiant heat loss.
#### C. Thermal Interface Material (TIM)
The "R0" designation typically indicates that the part comes with **T766** pre-applied. In electronics, the TIM fills microscopic air gaps between the component (silicon) and the heat sink (metal), which is critical because air is a poor conductor of heat.
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### 3. Application Use Cases
The ATS-P2-86-C1-R0 is generally found in:
* **Networking Hardware:** Routers, switches, and bridges.
* **Embedded Systems:** Industrial PCs and IoT gateways.
* **Power Supplies:** Cooling voltage regulators and MOSFETs.
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- ⤷What is the difference between the C1 and C2 versions of this heat sink?
- ⤷ How do I calculate if the 2.47 °C/W thermal resistance is sufficient for my chip?
- ⤷ Are there alternative mounting options if my PCB doesn't have push-pin holes?