The **ATS-P2-67-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed for cooling processors and high-power components. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define its physical and thermal characteristics: | Property | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance (Flowing Air)** | 2.03° C/W @ 200 LFM | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Fin Pattern** | Straight Fin (Cross-cut) | --- ### 2. Physical Design Features * **Heat Sink Profile:** It features a low-profile design (10mm height), making it ideal for compact server racks, networking equipment, and small form factor (SFF) enclosures. * **Material Science:** The use of **6063 Aluminum** provides a balance between high thermal conductivity and structural integrity. * **Anodization:** The blue anodized coating is not just for aesthetics; it increases the surface emissivity, slightly improving radiation heat transfer and providing corrosion resistance. --- ### 3. Attachment Mechanism (Push-Pin) The "P2" designation indicates the mounting style. This part uses a **spring-loaded push-pin** mechanism: 1. **Pressure Application:** The compression springs ensure a consistent and uniform load onto the electronic component (CPU/GPU/FPGA), which optimizes the interface with thermal paste or pads. 2. **Ease of Installation:** It requires pre-drilled holes in the PCB. Once pushed through, the pins expand to lock the sink in place without the need for specialized tools. --- ### 4. Thermal Performance Thermal resistance is the measure of how effectively the part moves heat away from the silicon. For the **ATS-P2-67-C1-R0**: * **At 200 LFM (Linear Feet per Minute):** The resistance is roughly **2.03° C/W**. * **Impact:** If your electronic chip generates 10 Watts of heat, the temperature of the chip will rise approximately 20.3°C above the ambient air temperature inside the case. --- ### 5. Common Applications * **Telecommunications:** Cooling of high-speed ASICs. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. * **Embedded Computing:** Cooling processors on industrial motherboards.