ATS-P2-61-C1-R0
AI

The **ATS-P2-61-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** product line, designed to optimize airflow and thermal dissipation for electronic components like processors, FPGAs, and ASICs.
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### 1. Technical Specifications
The following table highlights the core physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions** | 40mm x 40mm x 10mm |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 4.95°C/W (at 200 LFM) |
| **Fin Style** | Straight (maxiFLOW™ Pattern) |
| **Base Type** | Flat, square base |
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### 2. Key Components & Construction
The "Electronic Part" functionality is defined by three main sub-elements:
1. **The Heat Sink Body:**
Constructed from aluminum for high thermal conductivity. The **maxiFLOW™** design features a tapered fin structure which reduces pressure drop and increases surface area, allowing heat to transfer from the silicon die to the ambient air more efficiently.
2. **The pushPIN™ Attachment:**
Unlike simple adhesive tapes, this part uses a mechanical push-pin system with a built-in spring. This ensures constant **interface pressure**, which is critical for maintaining a stable thermal connection over the life of the electronic device.
3. **Thermal Interface Material (TIM):**
The "R0" suffix typically denotes that the part comes with a pre-applied high-performance thermal interface material (like a phase-change pad or grease). This fills microscopic air gaps between the chip and the heat sink.
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### 3. Usage Context in Electronics
This part is typically found in the following electronic environments:
* **Networking Hardware:** High-speed routers and switches where airflow is directional.
* **Embedded Systems:** Industrial PCs where vibration resistance (provided by the push-pins) is required.
* **Power Supplies:** Cooling MOSFETs or voltage regulators.
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### 4. Part Number Breakdown
* **ATS:** Advanced Thermal Solutions (Manufacturer)
* **P2:** Part of the pushPIN™ series
* **61:** Specific series/form factor
* **C1:** Blue Anodized Finish
* **R0:** Thermal Interface Material / Revision status
- ⤷
What is the difference between pushPIN and adhesive mounting for this heat sink?
- ⤷ How do I calculate the required LFM (Linear Feet per Minute) for my specific processor?
- ⤷ Are there copper versions of the ATS-61 series available for better conductivity?