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  • ATS-P2-61-C1-R0

  • AI
    The **ATS-P2-61-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** product line, designed to optimize airflow and thermal dissipation for electronic components like processors, FPGAs, and ASICs. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 40mm x 40mm x 10mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 4.95°C/W (at 200 LFM) | | **Fin Style** | Straight (maxiFLOW™ Pattern) | | **Base Type** | Flat, square base | --- ### 2. Key Components & Construction The "Electronic Part" functionality is defined by three main sub-elements: 1. **The Heat Sink Body:** Constructed from aluminum for high thermal conductivity. The **maxiFLOW™** design features a tapered fin structure which reduces pressure drop and increases surface area, allowing heat to transfer from the silicon die to the ambient air more efficiently. 2. **The pushPIN™ Attachment:** Unlike simple adhesive tapes, this part uses a mechanical push-pin system with a built-in spring. This ensures constant **interface pressure**, which is critical for maintaining a stable thermal connection over the life of the electronic device. 3. **Thermal Interface Material (TIM):** The "R0" suffix typically denotes that the part comes with a pre-applied high-performance thermal interface material (like a phase-change pad or grease). This fills microscopic air gaps between the chip and the heat sink. --- ### 3. Usage Context in Electronics This part is typically found in the following electronic environments: * **Networking Hardware:** High-speed routers and switches where airflow is directional. * **Embedded Systems:** Industrial PCs where vibration resistance (provided by the push-pins) is required. * **Power Supplies:** Cooling MOSFETs or voltage regulators. --- ### 4. Part Number Breakdown * **ATS:** Advanced Thermal Solutions (Manufacturer) * **P2:** Part of the pushPIN™ series * **61:** Specific series/form factor * **C1:** Blue Anodized Finish * **R0:** Thermal Interface Material / Revision status
    ✨ Follow-up Questions
    • ⤷ What is the difference between pushPIN and adhesive mounting for this heat sink?
    • ⤷ How do I calculate the required LFM (Linear Feet per Minute) for my specific processor?
    • ⤷ Are there copper versions of the ATS-61 series available for better conductivity?