AI

The **ATS-P2-46-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the "maxiFLOW™" series, which features a flared fin design to maximize cooling efficiency in constrained spaces.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics.
| Parameter | Specification |
| :--- | :--- |
| **Component Type** | Heat Sink (Passive) |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 25.00mm |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Fin Style** | Flared Fin (maxiFLOW™) |
| **Thermal Resistance** | 2.47°C/W (at 200 LFM) |
| **Interface Material** | T766 (Thermal Interface Material pre-applied) |
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### 2. Design Features
* **maxiFLOW™ Geometry:** The fins are tapered and flared outward. This design increases the surface area and creates more turbulence in the airflow, which significantly reduces the thermal resistance compared to straight-fin heat sinks.
* **pushPIN™ Attachment:** It uses a specialized mounting system consisting of a brass or plastic pin and a compression spring. This ensures consistent pressure across the surface of the electronic component (CPU, FPGA, or GPU), preventing air gaps.
* **Pre-Applied TIM:** The unit comes with a Phase Change Material (T766) or Thermal Tape pre-applied to the base, ensuring optimal heat transfer from the chip to the aluminum without requiring manual paste application.
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### 3. Electronic Application
This part is typically used to cool high-heat-generating integrated circuits (ICs) in the following sectors:
* **Networking:** Routers, switches, and base stations.
* **Computing:** Embedded systems, high-speed servers, and power supplies.
* **Industrial:** Motor controllers and power converters where space is limited but airflow is available.
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### 4. Thermal Performance Comparison
The performance of the ATS-P2-46-C1-R0 varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM):
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (Natural/Low) | 3.48 |
| 200 (Medium) | 2.47 |
| 400 (High) | 1.76 |
| 600 (Extreme) | 1.45 |
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How does the flared fin design compare to a standard straight fin in terms of airflow?
- ⤷ What are the specific mounting hole requirements for the pushPIN system?
- ⤷ Is this heat sink compatible with custom thermal interface materials instead of the pre-applied T766?