The **ATS-P2-44-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to optimize airflow and heat dissipation for electronic components. --- ## 1. Technical Specifications Below are the primary technical parameters for the ATS-P2-44-C3-R0: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 2.06°C/W (at 200 LFM) | | **Dimensions (L x W)** | 40.00mm x 40.00mm | | **Height** | 12.70mm | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ## 2. Key Design Features ### A. pushPIN™ Attachment This part utilizes a specific attachment mechanism called **pushPIN™**. It consists of: * **Compression Springs:** Provides precise pressure to ensure optimal contact with the heat source. * **Plastic/Brass Pins:** Securely locks the heat sink into pre-drilled holes on the PCB. ### B. maxiFLOW™ Fin Geometry The fin design is not a standard straight-fin configuration. It uses a **flared fin** profile which: * Increases the surface area for heat dissipation. * Reduces pressure drop, allowing air to flow more easily through the fins. * Enhances performance in both forced-air and natural convection environments. ### C. Thermal Interface Material (TIM) The part comes pre-applied with **T412**, which is a high-efficiency thermal tape. This eliminates the need for manual application of thermal grease and ensures a uniform bond between the component (like a CPU, GPU, or FPGA) and the heat sink. --- ## 3. Applications The ATS-P2-44-C3-R0 is typically used for cooling square-packaged electronic components such as: 1. **FPGAs and ASICs:** High-speed processing units that generate localized heat. 2. **Network Switches:** Components requiring low-profile cooling due to rack space constraints. 3. **Power Supplies:** Cooling MOSFETs or power regulators. --- ## 4. Performance at Airflow Thermal resistance varies based on the Linear Feet per Minute (LFM) of airflow: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 2.06 | | 400 | 2.0 | 1.42 | | 600 | 3.0 | 1.13 |