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  • ATS-P2-44-C1-R0

  • AI
    The **ATS-P2-44-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal properties. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (High Thermal Conductivity) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 5.00 °C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Attachment Method** | pushPIN™ | | **Pressure Spring** | Brass / Stainless Steel | --- ### 2. Key Components & Design Features #### A. The Fin Geometry (maxiFLOW™) Unlike standard straight-fin heat sinks, the ATS-P2-44-C1-R0 features a **tapered fin design**. This maximizes the surface area for heat radiation while minimizing the pressure drop. This design is highly effective in forced-air environments (fans). #### B. pushPIN™ Attachment This is the mechanical interface used to secure the heat sink to the PCB. * **Precision Springs:** Ensures a specific amount of force (clamping pressure) is applied to the electronic chip to optimize the Thermal Interface Material (TIM) performance. * **Nylon/Brass Bolts:** Secure the unit through pre-drilled holes in the motherboard. #### C. Thermal Interface Material (TIM) The "R0" at the end of the part number typically indicates the presence of a pre-applied **Phase Change Material** or thermal tape. This eliminates air gaps between the component and the heat sink, ensuring efficient heat transfer. --- ### 3. Application Use-Cases This specific size (40mm) and thermal profile are commonly found in: 1. **Network Switches & Routers:** Cooling the main processing ASIC. 2. **Industrial PCs:** Cooling embedded processors in fan-less or low-airflow chassis. 3. **Power Supplies:** Managing heat for MOSFETs or power regulators. --- ### 4. Thermal Performance Data The efficiency of this part is highly dependent on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 5.00 | | 400 (2.0 m/s) | 3.50 | | 600 (3.0 m/s) | 2.80 |
    ✨ Follow-up Questions
    • ⤷ What is the difference between blue anodized and black anodized finishes for heat sinks?
    • ⤷ How do I calculate the required LFM for my specific electronic component?
    • ⤷ Are there alternative attachment methods if my PCB doesn't have pushPIN holes?