ATS-P2-44-C1-R0
AI

The **ATS-P2-44-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal properties.
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (High Thermal Conductivity) |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 5.00 °C/W (Unducted Flow @ 200 LFM) |
| **Dimensions (L x W x H)** | 40mm x 40mm x 15mm |
| **Attachment Method** | pushPIN™ |
| **Pressure Spring** | Brass / Stainless Steel |
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### 2. Key Components & Design Features
#### A. The Fin Geometry (maxiFLOW™)
Unlike standard straight-fin heat sinks, the ATS-P2-44-C1-R0 features a **tapered fin design**. This maximizes the surface area for heat radiation while minimizing the pressure drop. This design is highly effective in forced-air environments (fans).
#### B. pushPIN™ Attachment
This is the mechanical interface used to secure the heat sink to the PCB.
* **Precision Springs:** Ensures a specific amount of force (clamping pressure) is applied to the electronic chip to optimize the Thermal Interface Material (TIM) performance.
* **Nylon/Brass Bolts:** Secure the unit through pre-drilled holes in the motherboard.
#### C. Thermal Interface Material (TIM)
The "R0" at the end of the part number typically indicates the presence of a pre-applied **Phase Change Material** or thermal tape. This eliminates air gaps between the component and the heat sink, ensuring efficient heat transfer.
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### 3. Application Use-Cases
This specific size (40mm) and thermal profile are commonly found in:
1. **Network Switches & Routers:** Cooling the main processing ASIC.
2. **Industrial PCs:** Cooling embedded processors in fan-less or low-airflow chassis.
3. **Power Supplies:** Managing heat for MOSFETs or power regulators.
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### 4. Thermal Performance Data
The efficiency of this part is highly dependent on the Air Velocity (Measured in Linear Feet per Minute - LFM):
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 200 (1.0 m/s) | 5.00 |
| 400 (2.0 m/s) | 3.50 |
| 600 (3.0 m/s) | 2.80 |
- ⤷
What is the difference between blue anodized and black anodized finishes for heat sinks?
- ⤷ How do I calculate the required LFM for my specific electronic component?
- ⤷ Are there alternative attachment methods if my PCB doesn't have pushPIN holes?