ATS-P2-42-C2-R0
AI

The **ATS-P2-42-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components like CPUs, GPUs, or high-power ASICs using a proprietary "push-pin" attachment mechanism.
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### 1. Technical Specifications
The part number encodes specific data about its dimensions, material, and thermal properties:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ Heat Sink |
| **Dimensions (L x W x H)** | 57.90mm x 60.96mm x 22.86mm |
| **Material** | Aluminum (AL6063) |
| **Fin Type** | Fine Pitch (straight fins) |
| **Attachment Method** | Push-Pin (Plastic/Brass) |
| **Thermal Interface Material (TIM)** | T766 (High performance) |
| **Finish** | Blue Anodized |
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### 2. Physical Design and Construction
The heat sink is engineered to maximize surface area while maintaining a low profile.
* **Fin Geometry:** The straight-fin design is optimized for high-velocity airflow environments (forced convection).
* **Base Material:** Made from **6063-T5 aluminum**, which provides an excellent balance of thermal conductivity and weight.
* **Blue Anodized Coating:** This finish not only protects the aluminum from corrosion but also slightly increases surface emissivity, aiding in heat radiation.
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### 3. Mounting & Thermal Interface
One of the key "electronic" advantages of this part is its installation reliability:
* **Push-Pin Attachment:** It uses a spring-loaded push-pin mechanism. This ensures constant, uniform pressure across the electronic chip, which is critical for minimizing thermal resistance.
* **Pre-applied TIM:** The "C2" in the part number indicates it comes with **T766 thermal grease** pre-applied. This ensures a bubble-free contact layer between the chip and the heat sink.
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### 4. Performance Data
The cooling efficiency depends on the air velocity (measured in Linear Feet per Minute - LFM):
| Airflow Velocity | Thermal Resistance (°C/W) |
| :--- | :--- |
| **200 LFM (1.0 m/s)** | 4.20 |
| **400 LFM (2.0 m/s)** | 1.80 |
| **600 LFM (3.0 m/s)** | 1.30 |
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### Summary Checklist for Engineering
If you are integrating this into a PCB design, note the following:
* **Hole Pattern:** Ensure your PCB has the corresponding drill holes for the push-pins.
* **Keep-out Zone:** Account for the 60.96mm width to avoid interference with nearby capacitors or inductors.
* **Airflow Direction:** Orient the fins parallel to the system fan's airflow for maximum efficiency.
- ⤷
What are the specific PCB hole dimensions required for the ATS push-pin mounting?
- ⤷ How does the T766 thermal interface material compare to standard silicone-based pastes?
- ⤷ Are there copper-base versions of this heat sink for higher power density applications?