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  • ATS-P2-42-C2-R0

  • AI
    The **ATS-P2-42-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components like CPUs, GPUs, or high-power ASICs using a proprietary "push-pin" attachment mechanism. --- ### 1. Technical Specifications The part number encodes specific data about its dimensions, material, and thermal properties: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ Heat Sink | | **Dimensions (L x W x H)** | 57.90mm x 60.96mm x 22.86mm | | **Material** | Aluminum (AL6063) | | **Fin Type** | Fine Pitch (straight fins) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Interface Material (TIM)** | T766 (High performance) | | **Finish** | Blue Anodized | --- ### 2. Physical Design and Construction The heat sink is engineered to maximize surface area while maintaining a low profile. * **Fin Geometry:** The straight-fin design is optimized for high-velocity airflow environments (forced convection). * **Base Material:** Made from **6063-T5 aluminum**, which provides an excellent balance of thermal conductivity and weight. * **Blue Anodized Coating:** This finish not only protects the aluminum from corrosion but also slightly increases surface emissivity, aiding in heat radiation. --- ### 3. Mounting & Thermal Interface One of the key "electronic" advantages of this part is its installation reliability: * **Push-Pin Attachment:** It uses a spring-loaded push-pin mechanism. This ensures constant, uniform pressure across the electronic chip, which is critical for minimizing thermal resistance. * **Pre-applied TIM:** The "C2" in the part number indicates it comes with **T766 thermal grease** pre-applied. This ensures a bubble-free contact layer between the chip and the heat sink. --- ### 4. Performance Data The cooling efficiency depends on the air velocity (measured in Linear Feet per Minute - LFM): | Airflow Velocity | Thermal Resistance (°C/W) | | :--- | :--- | | **200 LFM (1.0 m/s)** | 4.20 | | **400 LFM (2.0 m/s)** | 1.80 | | **600 LFM (3.0 m/s)** | 1.30 | --- ### Summary Checklist for Engineering If you are integrating this into a PCB design, note the following: * **Hole Pattern:** Ensure your PCB has the corresponding drill holes for the push-pins. * **Keep-out Zone:** Account for the 60.96mm width to avoid interference with nearby capacitors or inductors. * **Airflow Direction:** Orient the fins parallel to the system fan's airflow for maximum efficiency.
    ✨ Follow-up Questions
    • ⤷ What are the specific PCB hole dimensions required for the ATS push-pin mounting?
    • ⤷ How does the T766 thermal interface material compare to standard silicone-based pastes?
    • ⤷ Are there copper-base versions of this heat sink for higher power density applications?