The **ATS-P2-41-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### Technical Specifications The following table outlines the physical and thermal properties of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Type** | Push-Pin (Plastic or Brass) | | **Thermal Resistance (Flowing)** | 10.02 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 2.00 °C/W @ 700 LFM | | **Dimensions (L x W)** | 40.00mm x 40.00mm | | **Height (Fin)** | 20.00mm | | **Pitch** | Fine Pitch (Square Pattern) | --- ### Key Components & Features 1. **High-Performance Fin Design:** The part features a "Square-cut" or cross-cut fin geometry. This design increases the surface area for heat transfer and is optimized for omnidirectional airflow, meaning it performs well regardless of which direction the air is blowing from. 2. **pushPIN™ Attachment System:** Instead of using messy thermal adhesives or complex brackets, this part uses a spring-loaded push-pin mechanism. This provides: * **Consistent Pressure:** Ensures the base of the heat sink maintains firm contact with the electronic chip. * **Ease of Assembly:** Quick installation into pre-drilled holes on a PCB (Printed Circuit Board). 3. **Thermal Interface Material (TIM):** The "C1" in the part number indicates it comes pre-applied with **ATS-PPS-01** (or equivalent) high-performance thermal grease, ensuring low thermal resistance between the component and the heat sink right out of the box. 4. **Material and Finish:** It is made from lightweight aluminum. The **Blue Anodized** finish is not just for aesthetics; it protects the aluminum from oxidation and slightly improves radiant heat transfer. --- ### Comparison of Airflow Performance | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 10.02 | | 300 (1.5 m/s) | 3.64 | | 500 (2.5 m/s) | 2.52 | | 700 (3.5 m/s) | 2.00 | --- ### Common Applications * **Networking Equipment:** Routers, switches, and base stations. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Supplies:** Cooling MOSFETs and voltage regulators.