## Technical Overview of ATS-P2-39-C1-R0 The **ATS-P2-39-C1-R0** is a high-performance electronic thermal management component. Specifically, it is a **push-pin style heat sink** designed for cooling integrated circuits (ICs) and other electronic components. ### 1. Key Specifications The following table outlines the physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 18.94° C/W (at 100 LFM) | | **Attachment Method** | Push-Pin (Brass) with Compression Spring | | **Dimensions (L x W x H)** | 35mm x 35mm x 10mm | | **Weight** | ~11.45 grams | --- ### 2. Physical Design & Engineering The "Electronic" value of this part lies in its optimized design for airflow management within a PCB environment: * **Straight Fin Geometry:** The fins are arranged in a straight pattern, making it ideal for systems with directed airflow. It maximizes surface area while minimizing pressure drop. * **Compression Spring System:** The push-pin mechanism uses a precisely calibrated spring to provide consistent downward pressure. This ensures a high-quality thermal interface between the heat sink base and the electronic chip, reducing the **Contact Resistance**. * **Low Profile:** At only 10mm in height, this component is designed for modern electronics where vertical space (Z-height) is limited, such as in blade servers or 1U rackmount systems. --- ### 3. Application Use Cases This part is typically found in the following electronic sectors: 1. **Telecommunications:** Cooling for ASICs and FPGAs in networking switches. 2. **Computing:** Chipset cooling on motherboards or high-speed memory controllers. 3. **Power Electronics:** Dissipating heat from high-current voltage regulators. --- ### 4. Thermal Performance Comparison Thermal resistance varies based on the Airflow (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 18.94 | | 300 | 7.07 | | 500 | 4.88 | | 700 | 3.92 |