The **ATS-P2-37-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, or power modules. ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 26.36°C/W (at 100 LFM) to 5.92°C/W (at 700 LFM) | | **Dimensions (L x W)** | 35.00mm x 35.00mm | | **Height** | 20.00mm | | **Attachment Type** | Push-Pin (with Compression Springs) | | **Pitch** | 40.00mm (Mounting Hole Spacing) | --- ### 2. Key Design Features * **pushPIN™ Attachment:** This part utilizes a mechanical push-pin system with a compression spring. This ensures consistent pressure across the interface, which is critical for maximizing thermal transfer from the chip to the heat sink. * **Heat Sink Profile:** It features a **Straight-Fin** design. This is optimized for uni-directional airflow systems (forced convection), common in server racks and desktop enclosures. * **C3 Material/Interface:** The "C3" designation typically refers to the thermal interface material (TIM) or specific coating. In this case, it indicates the part comes with **T412** phase change material, which acts as the thermal "bridge" between the electronic component and the metal. ### 3. Thermal Performance Analysis Thermal resistance measures how effectively the part moves heat away from the silicon. Lower values (measured in °C/W) are better. | Airflow (LFM) | 100 | 300 | 500 | 700 | | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 26.36 | 10.82 | 6.84 | 5.92 | --- ### 4. Typical Applications * **BGA Components:** Used on Ball Grid Array processors that require active or passive cooling. * **Telecommunications:** Cooling of high-speed networking switches and routers. * **Industrial Electronics:** Power supply modules and motor controllers where heat density is high but space is limited. ---