The **ATS-P2-36-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from integrated circuits (ICs), such as CPUs, GPUs, or high-speed data processors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Attribute | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance (Flowing Air)** | 14.81°C/W @ 100 LFM | | **Thermal Resistance (Static Air)** | ~ (Requires active cooling for efficiency) | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 15mm | | **Attachment Method** | pushPIN™ | | **Spring Type** | Brass | --- ### 2. Key Design Features #### A. Fin Geometry * **Type:** Square pins / Cross-cut. * **Function:** The "P2" designation indicates a specific pin-fin pattern. Unlike traditional straight fins, pin-fins allow for omnidirectional airflow, meaning the heat sink remains effective regardless of which direction the cooling air is blowing from. #### B. pushPIN™ Attachment System This part utilizes a standardized mechanical attachment rather than adhesive tapes. * **Reliability:** Provides high pressure to ensure optimal contact with the heat source. * **Pre-assembled:** Comes with a flexible "push-pin" and a high-performance compression spring. * **Hole Pattern:** Requires specific PCB hole diameters (usually 3.175mm) for installation. #### C. Thermal Interface Material (TIM) * **Pre-applied:** The unit usually comes with **ATS-91** (a high-performance thermal pad or phase-change material) pre-applied to the base. This eliminates the need for manual thermal paste application and ensures a consistent thermal bond. --- ### 3. Applications and Usage This heat sink is typically found in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Embedded Systems:** Industrial PCs where space is limited but heat density is high. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. --- ### 4. Cooling Performance Summary As airflow (LFM - Linear Feet per Minute) increases, the thermal resistance drops significantly: | Air Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 14.81 | | 300 | 1.5 | 5.68 | | 500 | 2.5 | 3.85 | | 700 | 3.5 | 3.01 |