The **ATS-P2-31-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from integrated circuits (ICs), such as CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 25.33 °C/W (at 200 LFM) | | **Fin Style** | Straight | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 10.00mm | | **Pitch** | 1.27 mm | --- ### 2. Key Components & Features #### A. Thermal Interface Material (TIM) The "C3" in the part number indicates that the heat sink comes pre-applied with **T412 Thermal Interface Material**. This is a high-performance phase-change material that ensures minimal thermal resistance between the electronic component (the heat source) and the aluminum base. #### B. pushPIN™ Attachment Unlike adhesive-based heat sinks, the **pushPIN™** system uses a flexible, spring-loaded mechanism. - **Reliability:** Provides a consistent "clamping force" for better thermal contact. - **Serviceability:** Allows the heat sink to be removed and reinstalled without damaging the PCB. - **Hardware:** Includes a brass/plastic pin and a compression spring. #### C. Fin Design (Straight Fin) The part utilizes a straight-fin geometry. This is optimized for **forced convection** cooling (using a fan). The low profile (10mm height) makes it ideal for dense electronic enclosures or 1U server racks where vertical space is limited. --- ### 3. Part Number Breakdown The nomenclature follows the ATS standard convention: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **P2:** Part family identifier. * **31:** Specific design/series index. * **C3:** Material/Thermal Interface code (T412). * **R0:** Revision/Packaging code. --- ### 4. Typical Applications * **Networking Equipment:** High-speed routers and switches. * **Embedded Computing:** Industrial PC processors. * **Power Electronics:** DC-DC converters and MOSFET arrays.