The **ATS-P2-30-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from integrated circuits (ICs), such as CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions, fin style, and thermal interface material. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Heat Sink Type** | Straight Fin / Square | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W)** | 30mm x 30mm | | **Height** | 25mm | | **Attachment Method** | Push-Pin (with Spring) | | **Thermal Resistance** | 5.31°C/W (Unducted flow) | --- ### 2. Key Design Elements #### A. pushPIN™ Attachment System Unlike adhesive tapes or clips, this model uses a **push-pin and spring mechanism**. - **Reliability:** Provides constant pressure to ensure optimal contact with the electronic component. - **Easy Installation:** Pre-drilled holes in the PCB allow for quick assembly and disassembly without tools. #### B. Material and Coating - **Aluminum (AL6063):** Chosen for its high thermal conductivity and lightweight properties. - **Blue Anodized Finish:** This is not just aesthetic; anodization increases surface emissivity, slightly improving radiation heat transfer and protecting the aluminum from corrosion. #### C. Fin Geometry - The **Straight Fin** design is optimized for environments where there is a clear, directional airflow (forced convection). It allows air to pass through the channels efficiently to carry away heat. --- ### 3. Thermal Performance Profile Thermal resistance indicates how effectively the part moves heat away from the silicon. The performance varies based on air velocity: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 5.31 | | 200 (1.0 m/s) | 2.34 | | 300 (1.5 m/s) | 1.74 | | 500 (2.5 m/s) | 1.27 | --- ### 4. Comparison to Similar Parts The "C1" in the part number indicates the specific thermal interface material (TIM) or attachment configuration. - **R0:** This suffix typically denotes the revision or standard packaging compliance (RoHS). - **Size Compatibility:** The 30x30mm footprint is standard for many mid-range BGAs (Ball Grid Arrays) and small form factor power modules.