The **ATS-P2-210-C1-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** series of high-performance heat sinks designed for cooling integrated circuits (ICs), such as CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 70.00 mm x 70.00 mm x 12.70 mm | | **Thermal Resistance (Unducted)** | 0.51 °C/W @ 200 LFM | | **Flow Pattern** | Straight Fin | --- ### 2. Component Breakdown #### A. The Heat Sink (Thermal Management) The core of the part is a **straight-fin** aluminum body. - **Thermal Dissipation:** It is designed to pull heat away from the electronic component it is mounted on. - **Low Profile:** With a height of only 12.7mm, it is ideal for dense electronic assemblies where vertical space is limited. #### B. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a mechanical mounting system: - **Spring-Loaded Bolts:** These provide a consistent, high-pressure contact between the heat sink and the chip, ensuring maximum thermal transfer. - **Reliability:** Mechanical mounting is preferred in high-vibration environments where thermal tape or epoxy might fail. #### C. Interface Material Typically, these parts are pre-assembled with **Phase Change Material (PCM)** or a high-performance **Thermal Interface Material (TIM)** on the base. This fills microscopic air gaps between the chip and the heat sink. --- ### 3. Part Number Nomenclature Understanding the code **ATS-P2-210-C1-R0**: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **P2**: Series designation (pushPIN™). * **210**: Specific internal geometry/size code. * **C1**: Color/Finish (Blue Anodized). * **R0**: Revision or specific packaging code. --- ### 4. Typical Applications * **Telecommunications:** Cooling networking switches and routers. * **Industrial PC:** Heat dissipation for embedded processors. * **Power Supplies:** Cooling MOSFETs or power regulators. ---