The **ATS-P2-208-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 70mm x 70mm x 6mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 6.76°C/W (at 100 LFM) | | **Thermal Interface Material** | T412 (Phase change or conductive pad) | --- ### Key Design Elements #### 1. Heat Sink Type: pushPIN™ This part utilizes a "pushPIN" attachment mechanism. Unlike adhesive-based heat sinks, this uses a brass or plastic pin with a high-compression spring. This ensures: * **Constant Pressure:** Optimizes the contact between the component and the heat sink. * **Reliability:** Prevents the heat sink from shifting or falling off due to vibration or thermal expansion. #### 2. Fin Configuration: XC-Cut The "P2" in the part number often refers to the **XC-Cut** pattern. This is a cross-cut fin design which: * Increases surface area for cooling. * Allows for **omni-directional airflow**, meaning it can cool effectively regardless of which direction the air is blowing from. #### 3. Material and Coating * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** The anodization provides electrical insulation and corrosion resistance, while the blue dye helps in thermal radiation efficiency. #### 4. Thermal Interface Material (TIM) The **C3** designation indicates that the heat sink comes pre-applied with **T412 thermal interface material**. This material fills the microscopic air gaps between the electronic chip and the heat sink to ensure maximum heat transfer. --- ### Applications * **Networking Gear:** Switches and routers. * **Power Supplies:** Cooling MOSFETs and voltage regulators. * **Industrial PCs:** High-reliability computing in confined spaces. ---