The **ATS-P2-200-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications The following table summarizes the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Black Anodized) | | **Dimensions (L x W x H)** | 57.00mm x 61.00mm x 9.90mm | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 9.76°C/W (Unducted @ 200 LFM) | | **Thermal Interface Material** | T766 (Pre-applied phase change material) | | **Fin Style** | maxiFLOW (Tapered Fin Design) | --- ## 2. Key Electronic Features ### A. maxiFLOW™ Fin Geometry Unlike standard square-cut heat sinks, the ATS-P2-200-C1-R0 uses a flared or tapered fin design. This geometry: * Reduces static pressure drop. * Increases the surface area exposed to the airflow. * Allows for better cooling in low-airflow environments (Natural convection or low-speed fans). ### B. pushPIN™ Attachment System The "P2" in the part number indicates the use of the **pushPIN™** system. This is a critical feature for PCB protection: * **Compression Springs:** They provide a precise, repeatable force on the electronic chip, ensuring optimal contact with the Thermal Interface Material (TIM). * **Brass/Plastic Pins:** They securely lock the heat sink into pre-drilled holes on the PCB, preventing movement during shipping or vibration. ### C. Thermal Interface Material (T766) The unit comes with pre-applied **T766** material. This is a phase-change compound that fills microscopic air gaps between the chip die and the heat sink base, significantly reducing thermal impedance once the component reaches its operating temperature. --- ## 3. Typical Applications This specific part is often found in high-reliability electronic systems: * **Telecommunications:** Networking switches and routers. * **Industrial PC:** Embedded systems where vertical space is limited (9.9mm profile). * **Power Supplies:** Cooling high-wattage MOSFETs or voltage regulators. ---