The **ATS-P2-197-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" series, designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Property | Value / Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-pin (Plastic or Brass) | | **Thermal Resistance** | ~6.50°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm | --- ### 2. Component Design Features #### A. Fin Profile (Straight Fin) This model uses a **Straight Fin** design. * **Airflow:** Optimized for high-velocity air flowing in a single direction. * **Efficiency:** Excellent for systems with dedicated ducting or high-speed fans. #### B. Material and Thermal Interface * **Aluminum Construction:** Provides a balance between weight, cost, and thermal conductivity. * **Pre-Applied TIM:** This specific part usually comes with **T412** (a high-performance thermal interface material) pre-applied to the base, ensuring a low-resistance path between the electronic chip and the heat sink. #### C. pushPIN™ Attachment Mechanism Unlike adhesive tapes that can fail over time, the "pushPIN" system uses a spring-loaded mechanism: 1. **Uniform Pressure:** The springs provide consistent pressure across the component surface, maximizing heat transfer. 2. **Reliability:** It is more vibration-resistant than tape, making it suitable for industrial or telecommunications hardware. --- ### 3. Typical Electronic Applications The ATS-P2-197-C3-R0 is commonly used on the following electronic parts: * **Processors (CPUs/GPUs):** Low-profile cooling for embedded systems. * **FPGAs & ASICs:** Cooling high-gate-count programmable logic devices. * **Northbridge/Southbridge:** Chipsets on industrial motherboards. * **Power Modules:** MOSFET arrays or high-power voltage regulators. --- ### 4. Thermal Performance Comparison *Performance varies based on Airflow (LFM - Linear Feet per Minute):* | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 6.50 | | 300 | 1.5 | 3.10 | | 500 | 2.5 | 2.45 | | 700 | 3.5 | 2.10 |