The **ATS-P2-196-C3-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their *pushPIN™* series, designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Pitch** | Fine Pitch | | **Thermal Resistance** | 18.26°C/W (Unducted Flow @ 100 LFM) | --- ### 2. Breakdown of the Part Number The alphanumeric string provides specific details about the component's geometry and thermal properties: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **P2:** Series designation (pushPIN™). * **196:** Specific fin pattern and geometric configuration. * **C3:** Material/Finish code (Blue Anodized). * **R0:** Revision/Packaging code. --- ### 3. Electronic Application & Function This part is an **active/passive cooling interface**. In electronics, its role is to: 1. **Thermal Dissipation:** It increases the surface area of a semiconductor package, allowing heat to transfer more efficiently into the surrounding air. 2. **Mounting Security:** The `pushPIN™` mechanism uses a brass or plastic pin with a high-tension spring. This ensures a constant, reliable pressure between the heatsink and the electronic chip, which is critical for maximizing the effectiveness of Thermal Interface Material (TIM). 3. **Flow Optimization:** The "Fine Pitch" design is optimized for environments where there is forced air (fans), allowing the air to move through thin channels to carry away heat. --- ### 4. Thermal Performance Table Thermal resistance indicates how effectively the part cools. Lower °C/W values are better. | Air Velocity (LFM) | 100 | 300 | 500 | 700 | | :--- | :--- | :--- | :--- | :--- | | **Resistance (°C/W)** | 18.26 | 9.47 | 6.75 | 5.53 | --- ### 5. Implementation Example If you are designing a PCB and using this part, you would typically follow this structure in your BOM (Bill of Materials): ```yaml Component: Heatsink Manufacturer_PN: ATS-P2-196-C3-R0 Mounting_Type: Through-hole (pushPIN) Footprint_Requirement: 2-hole pattern (spacing varies by model) Recommended_TIM: Thermal Paste or Phase Change Material ```