The **ATS-P2-196-C1-R0** is a specific electronic component belonging to the **Thermal Management** category. It is a high-performance heat sink designed by Advanced Thermal Solutions (ATS) for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm | | **Thermal Resistance** | 18.07°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material (TIM)** | No TIM (Requires separate pad or grease) | --- ### 2. Design and Engineering Features ### A. Fin Profile (Straight Fin) This model utilizes a **straight fin** design. Straight fins are ideal for applications where there is a consistent, predictable airflow direction. They provide a large surface area for heat dissipation into the surrounding air. ### B. pushPIN™ Attachment System The "P2" in the part number refers to the pushPIN™ mounting system. This system is designed for: * **Ease of Assembly:** Quick installation without specialized tools. * **Secure Fit:** A compression spring provides consistent pressure across the interface for optimal thermal transfer. * **Reliability:** It reduces the risk of the heat sink shifting during vibration or shipping. ### C. Thermal Performance The efficiency of this heat sink is measured by its **Thermal Resistance**. Lower resistance is better. * **At 100 LFM (Linear Feet per Minute):** 18.07 °C/W * **At 700 LFM:** 4.66 °C/W * *Interpretation:* As airflow increases, the heat sink becomes significantly more efficient at removing heat. --- ### 3. Common Applications The ATS-P2-196-C1-R0 is commonly used in hardware environments where vertical space is limited (due to its low 10mm profile): 1. **Telecommunications:** Cooling of high-speed processors in routers and switches. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Cooling of MOSFETs or voltage regulators. 4. **LED Lighting:** Dissipating heat from high-power LED arrays. --- ### 4. Comparison with Similar Models | Model | Height | Thermal Resistance (100 LFM) | | :--- | :--- | :--- | | ATS-P2-196-C1-R0 | 10.00mm | 18.07 °C/W | | ATS-P2-197-C1-R0 | 15.00mm | 13.00 °C/W (Approx.) | ---