The **ATS-P2-195-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. It is designed to cool electronic components like CPUs, GPUs, or FPGAs in constrained environments. ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Specification | Detail | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ Heatsink | | **Material** | Aluminum (Blue Anodized Finish) | | **Dimensions** | 40mm x 40mm x 20mm | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 10.95°C/W (at 100 LFM) | | **Thermal Interface** | T766 (High performance phase-change material) | --- ### 2. Key Electronic Features The "electronic parts" of this assembly are focused on physical heat dissipation rather than active circuitry. #### A. Fin Design (Cross-Cut) The heatsink utilizes a **straight-fin or cross-cut design**. This increases surface area and allows for multi-directional airflow, making it ideal for electronic enclosures where air direction might be turbulent or inconsistent. #### B. Push-Pin Attachment Mechanism Rather than using adhesive tape (which can fail under high heat), this part uses a mechanical **Push-Pin and Spring** system: * **Compression Springs:** These provide precise, even pressure across the electronic chip (IC) to ensure maximum thermal contact. * **Safety:** Mechanical attachment prevents the heatsink from shifting during shipping or vibration, protecting delicate BGA (Ball Grid Array) solder joints. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the presence of **T766 thermal grease or pad**. This material fills the microscopic air gaps between the electronic component’s surface and the heatsink base, significantly lowering thermal resistance. --- ### 3. Application Use Cases This part is commonly found in the following electronic systems: 1. **Telecommunications:** High-speed routers and switches. 2. **Industrial PCs:** Cooling embedded processors in fanless or low-airflow environments. 3. **Power Supplies:** Dissipating heat from MOSFETs or power regulators.