The **ATS-P2-181-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" series, designed for efficient cooling of integrated circuits (ICs) and other PCB-mounted components. --- ### 1. Technical Specifications The part number defines specific physical and thermal characteristics. Here is the breakdown: | Specification | Details | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Fin Type** | Straight Fin (High Density) | | **Thermal Resistance** | ~1.18°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm | --- ### 2. Key Electronic Components Breakdown #### A. The Heat Sink Body The body is made of **6063-T5 aluminum**, chosen for its excellent thermal conductivity and lightweight properties. The "C1" in the part number indicates a specific thermal performance grade, and the "Blue Anodized" finish protects against corrosion and increases surface emissivity. #### B. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, this part uses a mechanical attachment system consisting of: * **Plastic/Brass Pins:** Inserted through pre-drilled holes in the PCB. * **Compression Springs:** Provide a precise, consistent "firm" pressure (load) on the electronic component (CPU, GPU, or FPGA), ensuring optimal thermal interface contact. #### C. Thermal Interface Material (TIM) The **-R0** suffix indicates that the unit typically comes with **pre-applied Phase Change Material (PCM)** or a high-performance thermal pad. This eliminates the need for manual application of thermal grease during assembly. --- ### 3. Typical Applications This specific low-profile (10mm height) heat sink is used in space-constrained electronic environments: * **Networking Gear:** Routers and switches. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Telecommunications:** High-speed data processing units. --- ### 4. Thermal Performance Data | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Unducted) | 2.40 | | 200 (Unducted) | 1.18 | | 400 (Unducted) | 0.85 |