The **ATS-P2-168-C3-R0** is a high-performance electronic thermal management component, specifically a **push-pin heat sink** manufactured by Advanced Thermal Solutions (ATS). Below is a detailed breakdown of its specifications and electronic application. --- ### 1. Technical Specifications This part is designed for cooling integrated circuits (ICs), high-speed processors, and power modules. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (with Blue Anodized finish) | | **Attachment Method** | Push-Pin (Plastic) | | **Fin Style** | Straight (optimized for airflow) | | **Thermal Resistance** | 6.94°C/W (undirected airflow) | | **Dimensions** | 45mm x 45mm x 25mm | --- ### 2. Component Breakdown The part consists of three primary electronic-mechanical sub-components: #### A. The Heat Sink Body * **Geometry:** It uses a square footprint (45mm) and a height of 25mm. * **Material:** Extruded aluminum, which provides high thermal conductivity and low weight. * **Finish:** The **Blue Anodized** finish is not just for aesthetics; it provides surface protection against corrosion and slightly increases emissivity for better radiant heat transfer. #### B. The Attachment Mechanism (Push-Pin) * **Purpose:** Securely fastens the heat sink to the Printed Circuit Board (PCB). * **Advantage:** Push-pins provide a consistent downward force (pressure) on the electronic chip, which is critical for the efficiency of the Thermal Interface Material (TIM). * **Material:** Usually high-temperature resistant plastic or brass with a compression spring. #### C. Thermal Interface Material (TIM) * **Pre-applied:** This specific model comes with **T766** pre-applied. * **Function:** This is a phase-change or grease-like layer at the base of the heat sink that fills microscopic air gaps between the electronic component (CPU/FPGA) and the heat sink, maximizing heat conduction. --- ### 3. Key Applications in Electronics The ATS-P2-168-C3-R0 is typically used in the following electronic environments: * **Networking Gear:** Cooling high-speed routers, switches, and gateways. * **Embedded Computing:** Protecting ARM processors or FPGAs from overheating in industrial enclosures. * **Power Electronics:** Dissipating heat from MOSFET arrays or Voltage Regulator Modules (VRMs). --- ### 4. Thermal Performance Data * **At 100 LFM (Linear Feet per Minute):** 6.94 °C/W * **At 500 LFM:** 2.62 °C/W * **At 700 LFM:** 2.30 °C/W *Note: Higher airflow (LFM) significantly lowers the thermal resistance, allowing the electronic part to run cooler at higher clock speeds.*