ATS-P2-154-C1-R0
AI

The **ATS-P2-154-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** product line, designed to provide high surface area for cooling electronic components such as processors, FPGAs, and ASICs.
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### 1. Technical Specifications
The following table summarizes the physical and thermal characteristics of this specific part:
| Characteristic | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions (L x W x H)** | 40mm x 40mm x 10mm |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 7.58°C/W (at 200 LFM) |
| **Fin Style** | Tapered (maxiFLOW™) |
| **Thermal Interface Material (TIM)** | No TIM (Part of the C1 series) |
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### 2. Key Electronic Components & Design
The "Electronic" aspect of this part refers to its function in protecting sensitive circuitry from thermal failure.
* **Tapered Fin Design:** The fins are shaped to maximize airflow and increase the surface area available for convection. This is critical for high-density PCBs where airflow might be obstructed.
* **pushPIN™ Attachment:** Instead of messy adhesives, this part uses a mechanical spring-loaded pin system. This ensures consistent pressure against the electronic chip, which improves heat transfer efficiency.
* **Blue Anodized Finish:** The surface treatment is not just aesthetic; it provides increased corrosion resistance and slightly improves emissivity for radiant heat transfer.
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### 3. Application Use Cases
This part is typically found in high-reliability electronic environments:
1. **Telecommunications:** Cooling networking chips in switches and routers.
2. **Embedded Systems:** Protecting microprocessors in industrial computing.
3. **Power Electronics:** Managing heat for high-output voltage regulators.
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### 4. Part Number Breakdown
Understanding the nomenclature helps in identifying similar components:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer: Advanced Thermal Solutions |
| **P2** | pushPIN™ series with specific spring/pin type |
| **154** | Dimensions and fin geometry code |
| **C1** | Thermal Interface Material (TIM) configuration (Typically no TIM) |
| **R0** | Revision/Standard package status |
- ⤷
How does the thermal resistance of this part change with different airflow (LFM) levels?
- ⤷ What are the specific hole diameter requirements for the pushPIN attachment?
- ⤷ Is there a version of this heat sink that comes with pre-applied Thermal Interface Material?