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  • ATS-P2-154-C1-R0

  • AI
    The **ATS-P2-154-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** product line, designed to provide high surface area for cooling electronic components such as processors, FPGAs, and ASICs. --- ### 1. Technical Specifications The following table summarizes the physical and thermal characteristics of this specific part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 7.58°C/W (at 200 LFM) | | **Fin Style** | Tapered (maxiFLOW™) | | **Thermal Interface Material (TIM)** | No TIM (Part of the C1 series) | --- ### 2. Key Electronic Components & Design The "Electronic" aspect of this part refers to its function in protecting sensitive circuitry from thermal failure. * **Tapered Fin Design:** The fins are shaped to maximize airflow and increase the surface area available for convection. This is critical for high-density PCBs where airflow might be obstructed. * **pushPIN™ Attachment:** Instead of messy adhesives, this part uses a mechanical spring-loaded pin system. This ensures consistent pressure against the electronic chip, which improves heat transfer efficiency. * **Blue Anodized Finish:** The surface treatment is not just aesthetic; it provides increased corrosion resistance and slightly improves emissivity for radiant heat transfer. --- ### 3. Application Use Cases This part is typically found in high-reliability electronic environments: 1. **Telecommunications:** Cooling networking chips in switches and routers. 2. **Embedded Systems:** Protecting microprocessors in industrial computing. 3. **Power Electronics:** Managing heat for high-output voltage regulators. --- ### 4. Part Number Breakdown Understanding the nomenclature helps in identifying similar components: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **P2** | pushPIN™ series with specific spring/pin type | | **154** | Dimensions and fin geometry code | | **C1** | Thermal Interface Material (TIM) configuration (Typically no TIM) | | **R0** | Revision/Standard package status |
    ✨ Follow-up Questions
    • ⤷ How does the thermal resistance of this part change with different airflow (LFM) levels?
    • ⤷ What are the specific hole diameter requirements for the pushPIN attachment?
    • ⤷ Is there a version of this heat sink that comes with pre-applied Thermal Interface Material?